Stencil Design For Mixed Technology Through-Hole / Smt Placement And Reflow
Published: |
June 12, 2023 |
Author: |
William E. Coleman, Denis Jean, Julie Bradbury |
Abstract: |
This paper will review stencil design requirements for printing solder paste around and in through-hole pads / openings. There is much interest in this procedure since full implementation allows the placement of both through-hole components as well as SMD's and the subsequent reflow of both simultaneously. This in turn eliminates the need to wave solder or hand solder through-hole components.... |
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