Body of Knowledge (BOK) for Leadless Quad Flat No-Lead/Bottom Termination Components (QFN/BTC) Package Trends and Reliability
Published: |
September 18, 2023 |
Author: |
Reza Ghaffarian, Ph.D. |
Abstract: |
As with many advancements in the electronics industry, consumer electronics is driving the trends for electronic packaging technologies toward reducing size and increasing functionality. Microelectronics meeting the technology needs for higher performance, reduced power consumption and size, and off the- shelf availability. Due to the breadth of work being performed in the area of microelectronics packaging/components, this report limits it presentation to board design, manufacturing, and processing parameters on assembly reliability for leadless (e.g., quad flat no-lead (QFN) or a generic term of bottom termination component (BTC)) packages. This style of package was selected for investigation because of its significant growth, lower cost, and improved functionality, especially for use in an RF application.... |
You must be a registered user to talk back to us. |
Company Information:
More articles from NASA Office Of Safety And Mission Assurance »
- Apr 22, 2024 - Microelectronics Reliability: Physics-of-Failure Based Modeling and Lifetime Evaluation
- Aug 14, 2023 - HALT/HASS and Thermal Cycling to Assess COTS Boards, GoPro Camera and Advanced PBGA/CCGA Virtex-5Electronic Packages
- Jan 23, 2023 - PCB Quality Metrics that Drive Reliability
- Sep 25, 2022 - Cracking Problems in Low-Voltage Chip Ceramic Capacitors
- Dec 21, 2021 - Reliability of PWB Microvias for High Density Package Assembly
- See all SMT / PCB technical articles from NASA Office Of Safety And Mission Assurance »
More SMT / PCB assembly technical articles »
- Mar 19, 2024 - What is Underfill | GPD Global
- Mar 19, 2024 - Made in Japan: Solder Paste Jet Dispensing Machine | I.C.T ( Dongguan ICT Technology Co., Ltd. )
- Feb 26, 2024 - Precision Control in Electronic Assembly: Selective Wave Soldering Machine | I.C.T ( Dongguan ICT Technology Co., Ltd. )
- Feb 02, 2024 - Maximizing Efficiency: The High-Speed SMT Line With Laser Depanelizer | I.C.T ( Dongguan ICT Technology Co., Ltd. )
- Dec 27, 2023 - Revolutionizing Tech: SMT Auto IC Programming Machine Mastery | I.C.T ( Dongguan ICT Technology Co., Ltd. )
- Browse Technical Library »
Body of Knowledge (BOK) for Leadless Quad Flat No-Lead/Bottom Termination Components (QFN/BTC) Package Trends and Reliability article has been viewed 167 times