Intel Packaging Databook

Published:

April 15, 1999

Author:

Intel Corporation

Abstract:

Intel's Packaging Databook is intended to serve as a data reference for engineering design, as well as a guide to Intel package selection and availability. IC assembly, performance characteristics, physical constants, detailed discussions of SMT, etc....

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Company Information:

Intel Corporation

Intel designs and builds the essential technologies that serve as the foundation for the world's computing devices.

Santa Clara, California, USA

Manufacturer of Components

  • Phone (408) 765-8080

Intel Corporation website

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