Thermal Profiling: A Practical Approach to Reflow Profiling
Published: |
December 14, 2009 |
Author: |
Liyakathali Koorithodi, Indium Corporation |
Abstract: |
In the lead-free era, thermal profiling has a critical role in the SMT assembly process. We discuss the profiling, tools, practical issues, and inspection methods of golden boards, and related tools. As the process window narrows, profiling equipment and/or thermocouple (TC) errors must be taken into consideration. In addition, the accuracy and attachment method of the thermocouple will significantly impact critical assemblies.... |
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