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Evaluating The Accuracy Of a Nondestructive Thermocouple Attach Method For Area-Array Package Profiling

Published:

January 6, 2011

Author:

Brian O' Leary, Tim Grove, Dr. S. Manian Ramkumar

Abstract:

The oven recipe, which consists of the reflow oven zone temperature settings and the speed of the conveyor, will determine a specific time‐temperature profile for a given PCB assembly. In order to achieve a good quality PCB assembly, the time‐temperature ...

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Company Information:

KIC's provides products and services designed to improve a variety of thermal monitoring, profiling and process control applications.

San Diego, California, USA

Consultant / Service Provider

  • Phone +1 (858) 673.6050
  • Fax +1 (858) 673.0085

See Company Website »

Company Postings:

(16) products in the catalog

(3) technical library articles

(283) news releases

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Industry 4.0 Reflow Oven

FPC* - Fluid Pressure Control - Dispensing Pump