Evaluating The Accuracy Of a Nondestructive Thermocouple Attach Method For Area-Array Package Profiling
Published: |
January 6, 2011 |
Author: |
Brian O' Leary, Tim Grove, Dr. S. Manian Ramkumar |
Abstract: |
The oven recipe, which consists of the reflow oven zone temperature settings and the speed of the conveyor, will determine a specific time‐temperature profile for a given PCB assembly. In order to achieve a good quality PCB assembly, the time‐temperature ... |
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