Surface Mount Rework Techniques
Published: |
May 9, 1999 |
Author: |
Brian Moylan |
Abstract: |
This Technical Note outlines, step by step, the easiest ways to remove and replace surface mounted devices, using the lowest possible temperatures. This document discusses the following topics: Removal and replacement of discrete and passive components (capacitors, resistors, SOTs), Removal of two-sided components (SOICs, SOJs, TSOPs), Removal of quad components (PLCCs, QFPs), Replacement of quad components including fine-pitched devices. ... |
You must be a registered user to talk back to us. |
Company Information:
- Jan 02, 2019 - Risk Mitigation in Hand Soldering
- Feb 22, 2018 - Hand Soldering with Lead Free Alloys
- Apr 23, 2015 - Rework Challenges for Smart Phones and Tablets
- Aug 14, 2013 - Profiling for Successful BGA/CSP Rework
- Nov 27, 2012 - Effective Qualification of Soldering Iron Performance Criteria
- See all SMT / PCB technical articles from Metcal »
More SMT / PCB assembly technical articles »
- Aug 20, 2024 - Thermal Interface Materials Drive Electronic Innovation | GPD Global
- Aug 20, 2024 - Underfill Materials Dispensing in Electronics Manufacturing Applications | GPD Global
- Jul 15, 2024 - Transforming LED Manufacturing: I.C.T Engineers Set Up Complete Production Line in Tajikistan | I.C.T ( Dongguan ICT Technology Co., Ltd. )
- Jun 20, 2024 - Case study: Precise Coating on Electronic Hearing Devices | ASYMTEK Products | Nordson Electronics Solutions
- Mar 19, 2024 - What is Underfill | GPD Global
- Browse Technical Library »
Surface Mount Rework Techniques article has been viewed 967 times