Defect-Based Test: A Key Enabler for Successful Migration to structural test
Published: |
May 6, 1999 |
Author: |
Sanjay Sengupta, Sandip Kundu, Sreejit Chakravart, Praveen Parvathal, Rajesh Galivanche, George Kosonocky, Mike Rodgers, TM Mak; MPG Test Technology, Intel Corp. |
Abstract: |
ntelís traditional microprocessor test methodology, based on manually generated functional tests that are applied at speed using functional testers, is facing serious challenges due to the rising cost of manual test generation and the increasing cost of high-speed testers. If current trends continue, the cost of testing a device could exceed the cost of manufacturing it. We therefore need to rely more on automatic test pattern generation (ATPG) and low-cost structural testers.... |
|
|
|
|
|
|
You must be a Company Information:
More articles from Intel Corporation »
- Dec 16, 2021 - Package-on-Package (PoP) Warpage Characteristic and Requirement
- Jan 06, 2021 - Challenges of Manufacturing with Printed Circuit Board Cavities
- Dec 12, 2019 - Voids in Solder Joints
- Oct 08, 2015 - Preparing for Increased Electrostatic Discharge Device Sensitivity
- Apr 16, 2015 - Stereo Vision Based Automated Solder Ball Height Detection
- See all SMT / PCB technical articles from Intel Corporation »
More SMT / PCB assembly technical articles »
- Aug 20, 2024 - Thermal Interface Materials Drive Electronic Innovation | GPD Global
- Aug 20, 2024 - Underfill Materials Dispensing in Electronics Manufacturing Applications | GPD Global
- Jul 15, 2024 - Transforming LED Manufacturing: I.C.T Engineers Set Up Complete Production Line in Tajikistan | I.C.T ( Dongguan ICT Technology Co., Ltd. )
- Jun 20, 2024 - Case study: Precise Coating on Electronic Hearing Devices | ASYMTEK Products | Nordson Electronics Solutions
- Mar 19, 2024 - What is Underfill | GPD Global
- Browse Technical Library »
Defect-Based Test: A Key Enabler for Successful Migration to structural test article has been viewed 541 times
.gif)
