Flux Collection and Self-Clean Technique in Reflow Applications

Published:

May 14, 2008

Author:

Speedline Technologies, Inc.

Abstract:

This paper will review some basic past and present flux chemistries that affect flux collection methodology. It will also review some of the most common flux collection methods, self-cleaning techniques, and maintenance goals. And, finally, data will be presented from high volume production testing of an advanced flux management system....

  • Download Flux Collection and Self-Clean Technique in Reflow Applications article
  • To read this article you need to have Adobe PDF installed

You must be a registered user to talk back to us.

 

Company Information:

Speedline Technologies serves the electronics assembly and semiconductor packaging industries with class-leading equipment, responsive support and unparalleled process knowledge.

Franklin, Massachusetts, USA

Manufacturer

  • Phone 5085414749
  • Fax 5085202288

See Company Website »

Company Postings:

(15) technical library articles

(19) news releases

  • Aug 20, 2024 - Thermal Interface Materials Drive Electronic Innovation | GPD Global
  • Aug 20, 2024 - Underfill Materials Dispensing in Electronics Manufacturing Applications | GPD Global
  • Jul 15, 2024 - Transforming LED Manufacturing: I.C.T Engineers Set Up Complete Production Line in Tajikistan | I.C.T ( Dongguan ICT Technology Co., Ltd. )
  • Jun 20, 2024 - Case study: Precise Coating on Electronic Hearing Devices | ASYMTEK Products | Nordson Electronics Solutions
  • Mar 19, 2024 - What is Underfill | GPD Global
  • Browse Technical Library »

Flux Collection and Self-Clean Technique in Reflow Applications article has been viewed 808 times

ICT Total SMT line Provider

Circuit Board, PCB Assembly & electronics manufacturing service provider