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Mitigation of Pure Tin Risk by Tin-Lead SMT Reflow- Results of an Industry Round-Robin

Published:

October 12, 2017

Author:

David Pinsky - Raytheon Integrated Defense Systems, Tom Hester - Raytheon Space and Airborne Systems, Dr. Anduin Touw - The Boeing Company, Dave Hillman - Rockwell Collins

Abstract:

The risk associated with whisker growth from pure tin solderable terminations is fully mitigated when all of the pure tin is dissolved into tin-lead solder during SMT reflow. In order to take full advantage of this phenomenon, it is necessary to understand the conditions under which such coverage can be assured. A round robin study has been performed by IPC Task group 8-81f, during which identical sets of test vehicles were assembled at multiple locations, in accordance with IPC J-STD-001, Class 3. All of the test vehicles were analyzed to determine the extent of complete tin dissolution on a variety of component types. Results of this study are presented together with relevant conclusions and recommendations to guide high reliability end-users on the applicability and limitations of this mitigation strategy....

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Company Information:

The Raytheon Company is a major American defense contractor and industrial corporation with core manufacturing concentrations in weapons and military and commercial electronics.

Waltham, Massachusetts, USA

Other

  • Phone 978-470-7238

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Company Postings:

(4) technical library articles

(1) news release

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