Void Detection in Large Solder Joints of Integrated Power Electronics

Published:

December 6, 2012

Author:

Patrick Schuchardt

Abstract:

Inspection of integrated power electronics equals sophisticated test task. X-ray inspection based on 2D / 2.5D principles not utilizable. Full 3D inspection with adapted image capturing and reconstruction is necessary for test task.... First published in the 2012 IPC APEX EXPO technical conference proceedings. ...

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Company Information:

Vendor of systems for Automated Optical Inspection (AOI), 3D X-Ray Inspection (AXI)and 3D solder paste inspection (SPI). The company's inline and stand-alone AOI systems won several "Best in Test Awards"

Jena, Germany

Manufacturer

  • Phone +49 (0)3641 6896-0

See Company Website »

Company Postings:

(16) products in the catalog

(2) technical library articles

(8) news releases

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