Void Detection in Large Solder Joints of Integrated Power Electronics
Published: |
December 6, 2012 |
Author: |
Patrick Schuchardt |
Abstract: |
Inspection of integrated power electronics equals sophisticated test task. X-ray inspection based on 2D / 2.5D principles not utilizable. Full 3D inspection with adapted image capturing and reconstruction is necessary for test task.... First published in the 2012 IPC APEX EXPO technical conference proceedings. ... |
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