Use of Non Etching Adhesion Promoters in Advanced PCB Applications
Published: |
June 16, 2011 |
Author: |
Roger Massey, Adrian Zee |
Abstract: |
Based on tests carried out with commercially available chemistry, this paper discusses the advantages available through the use of NEAP processes for inner layer bonding and soldermask pretreatment. The process is characterized with a view to high volume ... |
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