Vi Technology 3D SPI
Model: |
Vi Technology 3D SPI |
Category: |
|
Model Year: |
2009 |
Condition: |
|
Location: |
USA |
Offered by: |
|
| Contact Lewis & Clark |
Make: VI Technologies
Model: 3D Solder Paste Inspection
Vintage: 2009
Details:
1. FAHP (flying absolute height profilometry) measurement method
2. Dual light source and on the fly image scan
3. High power M/H light 3D sensor
4. Shadow free inspection based
5. High speed linear motors with closed loop high resolution linear encoders
6. Automatic conveyor width adjustment for boards up to 510mm x 460mm
7. Height accuracy on certification plate: < 3um at 3 sigma
8. Height repeatability on certification plate: < 2% at 3 sigma
9. Gage R&R: < 10%
10. Volume repeatability on certification plate: <2% at 3 sigma
11. Inspection time: 20 square cm/s (without shadow effect)
12. OS: Windows XP Professional
13. 17” monitor
Condition: Complete off-line June 2014
Location: USA/EXW
Available: Immediate for Purchase
http://youtu.be/PZ7zQM-9FsA
Company Information:
