Apr 23, 2019 SMTA announces registration is now open for the 2nd Annual eSMART Factory Conference on June 20-21, 2019 at the Dearborn Inn in Dearborn, MI, USA. Co-organized by Global SMT & Packaging magazine and SMTA, this conference brings together the key technologies shaping the electronics manufacturing industry including software systems and processes, augmented reality and alternative systems.
The technical program is finalized with participation from companies leading the technology transformation including Aegis Corporation, Cadence, Celestica, Rockwell Automation, Siemens, Tempo Automation, and more.
Dr. Irene J. Petrick, Senior Director of Industrial Innovation at Intel Corporation, will present the opening keynote on “Building an AI-Ready Culture.” She will discuss what it takes to enable digitization within a company, emphasizing a strategic fit between technology, process and people. Dr. Petrick asserts that companies must consider how to build data driven thinking, how to link AI goals with the compute architecture; and how to jump the ambition to execution gap.
Brian Toleno, Ph.D., Director of New Technology at Microsoft Corporation, will keynote the second day of the conference. His presentation is titled “Augmented Reality, Next Generation Computing for Front Line Workers.”
Attendees will enjoy a complimentary tour of the Ford Rouge Factory Complex at 5:30pm on June 20. The tour provides an inside look at the actual assembly plant of the iconic Ford F-150 in what is still Ford’s largest factory.
A tabletop exhibition is co-located in the conference auditorium. Sponsorship and tables are still available for purchase. Contact Sandy Daneau: sdaneau@globalsmt.net or +1 (239) 234-1600 or visit https://esmartfactory.net/table-top-sponsorships/ for details.
For more information about the conference, contact Jaclyn Sarandrea: jaclyn@smta.org or +1 (952) 920-7682 or visit https://esmartfactory.net.
The SMTA membership is an international network of professionals who build skills, share practical experience and develop solutions in electronic assembly technologies, including microsystems, emerging technologies, and related business operations.
The Global Assembly Journal for SMT & Advanced Packaging Professionals enters its 19th year providing the latest printed circuit board technology and electronics manufacturing news, process tips and SMT industry news to professionals in the surface mount and semiconductor advanced packaging industry. Global SMT & Packaging is the world’s leading B2B magazine for electronics assembly and advanced packaging professionals.
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