SMT, PCB Electronics Industry News
  • SMTnet
  • »
  • Industry News
  • »
  • Viscom SI Release 7.46 – more performance for Viscom 3-D SPI, AOI and AXI

Viscom SI Release 7.46 – more performance for Viscom 3-D SPI, AOI and AXI

Jun 18, 2013

3-D display of a solder paste defect with the Viscom  SPI 3-D Viewer.

3-D display of a solder paste defect with the Viscom SPI 3-D Viewer.

With the Software Release SI 7.46, the developers at Viscom have integrated many new functionalities that further increase the performance capability of its inspection systems. This reaches from cycle time reduction for typical component types through improvements in the global use of inspection libraries, up to innovations in the areas of 3-D SPI and X-ray inspection. All innovations involve the Viscom software SI.

The SI Release 7.46 provides customers with innovations that further boost the performance and convenience of both optical and X-ray inspection. Additionally, the new software version features numerous other improvements that relieve the operator and increase system performance.

For example, AOI inspection times can be further reduced with the 8M technology. This has been accomplished through improved optimization of the travel paths. This way, the same reliable inspection can be attained with fewer axis positions.

An additional highlight is the integration of the Library Manager. By using this software tool, new inspection patterns can be assigned even more quickly and easily. Therefore, the use of local and global inspection libraries is even more convenient. The new functionality can be used in parallel with the tried and tested library toolbox.

Another software advancement concerns the AOI Desktop system S2088-II and was initiated by a customer request. It enables the detailed appraisal of recognized defects in parallel with defect verification. In the review process, live images  of the defects can be displayed on the HARAN verification station. The camera head moves directly to the defect position  with a simple keypress. Thus, a live capture of the defect image can be viewed under different camera perspectives — orthogonal and angled — and in color.

Release 7.46 also brings further interesting developments in 3-D solder paste inspection. This inspection has proven itself in practice and due to Quality Uplink, enables convenient process optimization. With the new Release, the SPI Closed Loop (Downlink) has been completely integrated. With it, it is possible to return currently measured displacement values of the SPI inspection to the paste printer as offset correction values. Thus, an automatic correction of the print stencil can be carried out if the print image is displaced during production. Furthermore, there is an option to initiate automatic cleaning of the paste printer. EKRA, DEK and Speedline (MPM) interfaces already have been successfully implemented in field test; other interfaces can be integrated on request or already are in development.

 

Dec 25, 2023 -

Viscom to Showcase Inspection of Electronics for Different Customer Requirements at NORTEC 2024

Dec 11, 2023 -

iS6059 PCB Inspection Plus Wins Mexico Technology Award

Oct 23, 2023 -

Fast Double-Sided Inspection from Viscom at productronica 2023

Oct 16, 2023 -

Various Facets of Artificial Intelligence at the Viscom Technology Forum 2023

Oct 16, 2023 -

Viscom Places Special Focus on Networking Topics at SMTA Mexico 2023

Oct 09, 2023 -

Advanced Quality Control from Viscom at NEPCON Asia 2023 in Shenzhen

Sep 04, 2023 -

Inspection Technologies from Viscom at NEPCON Vietnam

Aug 29, 2023 -

Innovative Inspection Technologies from Exacom at the Battery Show North America

Aug 29, 2023 -

Viscom Inc. Exhibiting at SMTA International 2023

Dec 07, 2022 -

Viscom's Newest Inspection Technologies at IPC APEX EXPO 2023

141 more news from Viscom AG »

Aug 14, 2024 -

ViTrox Recognized for Smart Manufacturing Leadership Award at MSMA 2023

Aug 14, 2024 -

ViTrox Partners with SMTo Engineering to Showcase Cutting-Edge SMT PCBA Solutions at SMTA Guadalajara 2024

Aug 12, 2024 -

Equipment Exchange Auction Happing Now

Aug 12, 2024 -

PVA to Exhibit at SMTA Guadalajara 2024, Showcasing Advanced Coating Technologies and Robust Support Network

Aug 12, 2024 -

Explore the Latest Innovations in SMT Material Handling from Inovaxe at SMTA Guadalajara

Aug 12, 2024 -

Altus Group Strengthens Support Excellence with New Team Member

Aug 12, 2024 -

Semi-Kinetics Expands Capabilities with Installation of Three Koh Young 3D Automated Optical Inspection Systems

Aug 12, 2024 -

SHENMAO Introduces Rosin-Free No-Clean Liquid Flux SM-ZR10 for Automatic Wave Soldering Process

Aug 12, 2024 -

Anda Technologies Appoints Tech Gear Ltd. as Distributor in Hungary

Aug 12, 2024 -

ZESTRON Hosts Webinar on Cleaning Strategies and Corrosion Mitigation to Advance Reliability in Automotive Power Electronics

See electronics manufacturing industry news »

Viscom SI Release 7.46 – more performance for Viscom 3-D SPI, AOI and AXI news release has been viewed 1091 times

  • SMTnet
  • »
  • Industry News
  • »
  • Viscom SI Release 7.46 – more performance for Viscom 3-D SPI, AOI and AXI
Jade Series Selective Soldering Machines

Electronics Equipment Consignment