Aug 07, 2001 application in some of today�s fastest growing high tech applications where
cost, broadband and high frequency performance, thermal management and
stable properties are key. These applications include next generation
wireless and broadband communications and optical networking. Now there�s a
well-stocked source of key information � from basics to detailed
applications information � at IMAPS� CII (Ceramic Interconnect Initiative)
Internet web site. Sponsored by The International Microelectronics And
Packaging Society (IMAPS), the web site �
http://www.imaps.org/cii/index.htm - showcases the most recent advances in
ceramic interconnect technology, materials and processes for many existing
and emerging applications such as those in wireless telecommunications,
optical networking and automotive electronics
The CII web site offers a wide array of information including case histories
and in-depth application information for applications including automotive,
military, medical, Telecom, and Industrial/Power industries; Technical
papers; industry workshops, symposia, and events; and presentations made at
leading industry meeting and workshops
Samuel J. Horowitz, Ph.D., Marketing Manager, DuPont iTechnologies, and CII
Chair, said, �The industry is becoming increasingly aware of the important
role ceramic interconnect technology can play in solving key packaging
problems. For example, next generation 3 G wireless headsets will be
significantly more complex than the 2 G handsets we use today with more
circuits and functions packed in a smaller less expensive form factor.
Smaller, lighter, multifunction RF modules based on new concepts in
Integrated ceramic packaging will be key achieving very challenging cost and
performance goals.�
The Ceramic Interconnect Initiative (CII) is an IMAPS activity with the goal
of increasing the awareness of the benefits of ceramic technology for
electronic interconnect and packaging. CII activities include sponsoring
industry workshops and seminars, providing expert speakers, development of a
Ceramic Industry roadmap, and more.
IMAPS is a society dedicated to the advancement and growth of the use of
microelectronics and electronic packaging through professional and public
education, the dissemination of information and the promotion of the Society
�s portfolio of technologies. Contact IMAPS at 611 2nd Street, NE,
Washington, DC 20002, U.S.A., E-mail: IMAPS@imaps.org.; Tel. 202-548-4001;
Fax 202-548-6115; Home Page: http://www.imaps.org.
