May 06, 2014 
Indium Corporation’s Ed Briggs, senior technical support engineer, will present at the International Conference on Soldering and Reliability Wednesday, May 14 in Toronto, Canada.
Briggs’ presentation, Meeting Future Stencil Printing Challenges with Ultrafine Powder Solder Pastes, discusses a statistical comparison of the transfer efficiency of different solder powder particle sizes, specifically types 3, 4, 5, and 6, and reviews observations of post-reflow results in both optimal and harsh conditions.
For more information, visit www.smta.org/icsr.
Briggs is an SMTA-certified process engineer. He earned his associate’s degree in chemical technology from Mohawk Valley Community College, where he received the Douglas J. Bauer Award for Excellence in Chemistry, and earned his Six Sigma Green Belt from Dartmouth College. Briggs joined Indium Corporation in 1990 and has held a variety of positions in production and technical support.
Indium Corporation is a premier materials manufacturer and supplier to the global electronics, semiconductor, solar, thin-film, and thermal management markets. Products include solders and fluxes; brazes; thermal interface materials; sputtering targets; indium, gallium, germanium, and tin metals and inorganic compounds; and NanoFoil®. Founded in 1934, Indium has global technical support and factories located in China, Singapore, South Korea, the United Kingdom, and the USA. For more information about Indium Corporation, visit www.indium.com or email abrown@indium.com.
