Feb 27, 2001 IPC- Association Connecting Electronics Industries® has announced a call for papers for the IPC Annual Meeting, which takes place October 8-13, 2001, at the Rosen Centre Hotel in Orlando, FL.
Selected papers will be presented at the Advancing into Tomorrow's HDI and Advanced Packaging Today technical conference October 11-12, 2001. Papers are being sought on materials, processes, reliability/market applications, technology and field data/market drivers in all areas dealing with:
- Current carrying capacity
- Dielectrics and conductive materials
- High density flex circuits
- Ultra thin folds
- Laser material processing
- Roadblocks to microvia fabrication
- Via fill techniques
- Micro drilling technology
- Plating reliability
- Microvia inspection
- World market applications
- Electrical test for HDI
- Comparisons and trade-offs for CSP, BGA and fine pitch components
- Final finishes
- Flex circuit interposers
- Non-conductive adhesives and encapsulants
- Buried/Embedded components
- Solderability
- Flip chip, BGA and fine pitch assembly
- Yield improvement
- Market drivers for SMT and product miniaturization
- Solder fatigue modeling
- Reliability test and predictions
Paper presentations should be 30 minutes in length. Presentations will be grouped together in a forum or panel discussion. They must be non-commercial in nature, focusing on technology rather than a company's product. Papers deemed commercial will not be accepted.
Abstracts summarizing the topic must be received by June 1, 2001, and should be approximately 200-300 words long and include a biography. The paper/visual submission deadline is July 31, 2001.
For more information on submitting an abstract for a paper presentation at the IPC Annual Meeting, contact John Perry, IPC technical project manager, at 847-790-5318, or e-mail johnperry@ipc.org
IPC (www.IPC.org) is a global industry association based in Bannockburn, Ill., dedicated to the competitive excellence and financial success of its 3,500 member companies which represent all facets of the electronics industry, including design, printed board manufacturing, electronics assembly and test. As a member-driven organization and leading source for industry standards, training, market research and public policy advocacy, IPC supports programs to meet the needs of an estimated $2 trillion global electronics industry. IPC maintains additional offices in Taos, N.M.; Washington, D.C..; Stockholm, Sweden; Moscow, Russia; Bangalore and New Delhi, India; Bangkok, Thailand; and Qingdao, Shanghai, Shenzhen, Suzhou, Chengdu and Beijing, China.
»
