Oct 28, 2011 
Seika Machinery, Inc., a leading provider of advanced machinery, materials and engineering services, announces that an independent lab has confirmed that its Solder Paste Recycling (SPR) machine is capable of producing pure solder ingots from solder paste.
The ingots produced by the SPR Unit are 100 percent pure with no additives or impurities added to the solder paste during the recycling process. The system removes the flux from the metal and produces a flux-free ingot.
The report confirmed there is no flux residue in the solder ingots produced by the SPR system. This was confirmed with the execution of a number of sophisticated analyses including Fourier Transform Infrared Spectroscopy (FTIR), Inductively Coupled Plasma (ICP) technique and Scanning Electron Microscopy (SEM). Additionally, there are no voids inside the solder ingots, eliminating any possibility of flux being trapped inside.
Seika’s SPR machine enables 100 percent of the metal content of waste solder paste to be recovered as solder bar. The system provides a major decrease in disposal costs for factory waste, a reduction in CO2 emissions and reduced costs for solder bar as a result of recycling waste.
Seika Machinery, Inc. (SMI) is a subsidiary of Seika Corporation, Japan and member of the Mitsubishi Global Group. SMI provides electronics manufacturers with advanced machinery, superior materials and engineering services.
