Jun 26, 2008 To facilitate high volume, ultra-precise coating of wafers with die attach materials, epoxy or protective backside coatings down to 25 microns in thickness, DEK has developed a breakthrough process solution termed DirEKt Coat�. Unlike conventional dispensing techniques that cannot achieve emerging UPH requirements, often cause reliability issues due to poor or uneven material coverage and limit chip footprints because of fillet formation and resin bleed challenges, DEK�s DirEKt Coat offers a high throughput, screen printing-based solution that eliminates many of the inherent challenges associated with serial, dispensing methodologies. Enabled by an ultra-flat pallet for maximum wafer stability and uniformity, a specialty squeegee and a wafer shield, the DirEKt Coat system allows for precise, high-speed coating processes on wafers as thin as 100 microns and up to 300mm in diameter. Additional benefits include as much as a 20% to 30% reduction in materials cost as compared to die attach film products, improved inventory management, customer-specified bondline thickness control and footprint reduction through the elimination of the fillet. Like all DEK systems, the versatility of DirEKt Coat�s host print platform allows for extremely low cost of ownership, as the system can easily be re-deployed to run a variety of other processes.
Extending its mass imaging ingenuity to other disciplines, DEK has drawn from its 40-year experience in surface-mount, packaging and solar technologies to develop and deliver a complete solar cell metallization line capable of producing 1200 wafers per hour. DEK-engineered loading, buffering, inspection, wafer-flipping and printing systems are integrated with externally sourced advanced dryers to offer a total front-to-back solution for high-volume photovoltaic production. DEK�s Alternative Energies staff will be on hand over the three days of the Semicon West event to discuss DEK Solar process advantages and integration of its PVL1200 loader, PVB1200 buffer, PVI1200 inspection station, PVF1200 buffer/flipper and PVP1200 high-precision screen printers.
As a key enabler for all materials printing processes, robust stencil technologies are essential for high-yield manufacturing operations. In addition to its stainless steel, electroformed, nickel and PumpPrint� foils, DEK�s pioneering VectorGuard� interchangeable stencil system now allows for ultra fine-pitch semiconductor printing with its latest Platinum foil technology. Ideal for applications such as BGAs, flip chips, direct chip attach and wafer-level packaging, the micro-engineered VectorGuard Platinum delivers a robust stencil solution capable of achieving apertures of 20�m on 50�m pitch. As a VectorGuard product, the inherent flexibility benefits of quick product changeover and cost savings are at the core of the Platinum offering.
All of these technologies and DEK�s expert staff will be on hand throughout the three-days of Semicon West. Show delegates are invited to visit booth #8111 in West Hall, Level 2 of Moscone Center to find out how DEK can improve process efficiency and boost productivity.
About DEK
DEK is a global provider of advanced materials deposition technologies and support solutions including printing equipment platforms, stencils, precision screens and mass imaging processes used across a wide range of applications in electronics pre-placement subassembly, semiconductor wafer manufacture, and alternative energy component production. For more information, visit DEK at http://www.dek.com
