SMT, PCB Electronics Industry News
  • SMTnet
  • »
  • Industry News
  • »
  • Nordson DAGE’s Complete Solution for Automated On-Wafer Bondtesting Recognized with a Global Technology Award

Nordson DAGE’s Complete Solution for Automated On-Wafer Bondtesting Recognized with a Global Technology Award

Nov 16, 2018

Nordson DAGE, a division of Nordson Corporation (NASDAQ: NDSN), announces that it was awarded a 2018 Global Technology Award in the category of Test Equipment for its 4800 INTEGRA Automatic Wafer Bondtester. The 4800 is the complete solution for automated on wafer bond testing ensuring virtually operator free testing. It is specifically designed for advanced high-density interconnects in both front and back-end applications and utilizes recent advances in operator free technology. The Global Technology Awards recognize and celebrate innovation in electronics manufacturing. Premier products based on the finest examples of creative advancement in technology are chosen by a distinguished panel of industry experts and the Award was presented to the company during a ceremony that took place during SMTA International.

The 4800 INTEGRA enables 24/7 quality control on bumps as small as <20µm and is 450 mm panel/tapeframe capable. With full SECS/GEM communication, automated handling/alignment and on-board tool cleaning, this system is a breakthrough product for dedicated clean room wafer bond test quality control.

Alan King, Business Director – Bond and Materials Test commented “Auto parts handling combined with auto test routines is fast becoming the future for production bond testing. The 4800 INTEGRA is a perfect example of how to combine generations of bond testing experience and expertise with industry leading wafer handling hardware addressing the emerging need for the testing of advanced high-density interconnect. Since its launch the 4800 INTEGRA has established its place as the most advanced bond testing platform ever designed and it proudly sits at the head of the Nordson DAGE range of Semiconductor equipment.”


Headquartered in Aylesbury, UK, Nordson DAGE is a unit of the Nordson Corporation and manufactures and supports a complete range of award winning digital X-ray inspection systems and bond test equipment for the printed circuit board assembly and semiconductor industries. For more information, visit www.nordsondage.com.

Nordson Corporation engineers, manufactures and markets differentiated products and systems used to dispense, apply and control adhesives, coatingspolymerssealantsbiomaterials, and other fluidsto test and inspect for quality, and to treat and cure surfaces.  These products are supported by application expertise and direct global sales and service.  Nordson serves a wide variety of consumer non-durable, durable and technology end markets including packaging, nonwovens, electronics, medical, appliances, energy, transportation, construction, and general product assembly and finishing.  Founded in 1954 and headquartered in Westlake, Ohio, the company has operations and support offices in nearly 40 countries.  Visit Nordson on the web at www.nordson.comwww.twitter.com/Nordson_Corp or www.facebook.com/nordson.

Jun 10, 2021 -

AQS, Inc. Selects DAGE Assure Intelligent X-ray Component Counter for Mass Production

Jun 02, 2021 -

SVTronics Implements New DAGE AssureIntelligent X-ray Component Counter in Production

Jan 06, 2021 -

Intelligent Manufacturing Solutions, LLC.(IMS) Installs AssureTM X-ray Component Counter from DAGE at itsManchester, NH Operation

Oct 27, 2020 -

New DAGE Prospector™ Micro Materials Tester Impresses with Another Award

Oct 04, 2020 -

DAGE Assure FLEX, the new Intelligent X-ray Component Counter from Nordson ELECTRONICS SOLUTIONS, Wins GLOBAL Technology Award

Oct 03, 2020 -

DAGE AssureFLEX,the new Intelligent X-ray Component Counter from Nordson ELECTRONICS SOLUTIONS, Wins GLOBAL Technology Award

Apr 30, 2020 -

DAGE Is Honoured with a Prestigious Queen's Award for Enterprise for International Trade

Feb 06, 2020 -

DAGE AssureTM,the New Intelligent X-ray Component Counter from Nordson ELECTRONICS SOLUTIONS, Wins NPI Award

Feb 06, 2020 -

New DAGEProspector™ Micro Materials Tester Impresses with a 2020 NPI Award

Dec 10, 2019 -

Exceed Testing Demands with the New Nordson DAGE Prospector™ Micro Materials Tester

130 more news from Nordson DAGE »

Aug 28, 2024 -

Mencom to Exhibit at More Than MFG Expo 2024

Aug 28, 2024 -

Can Laser Technology Save Your Catheter Manufacturing?

Aug 26, 2024 -

North American EMS Industry Up 1.9 Percent in July

Aug 26, 2024 -

PVA Welcomes Rod Kasperson as Global Sales Manager

Aug 26, 2024 -

Seika Machinery Hosts Second Webinar on Process Control: Advanced Testing and Profiling Techniques

Aug 26, 2024 -

Libra Industries Welcomes Charlie Gaddis as Chief Financial Officer

Aug 26, 2024 -

IPC Partners with Stephen F. Austin State University's CARRI and the IPC Education Foundation for Workforce Development in Electronics Manufacturing

Aug 26, 2024 -

Silicon Mountain Contract Services Announces Preparation for ITAR Registration

Aug 26, 2024 -

Murray Percival Company to Exhibit at SMTA Michigan and Ohio Expos

Aug 26, 2024 -

Altus Strengthens its Partnership with Active-PCB Solutions Through Further Investment in Koh Young Technology

See electronics manufacturing industry news »

Nordson DAGE’s Complete Solution for Automated On-Wafer Bondtesting Recognized with a Global Technology Award news release has been viewed 953 times

  • SMTnet
  • »
  • Industry News
  • »
  • Nordson DAGE’s Complete Solution for Automated On-Wafer Bondtesting Recognized with a Global Technology Award
Void Free Reflow Soldering

Reflow Oven