Oct 06, 2010
The presentation will discuss the latest information on the development and optimization of the miniature component assembly process. Significant process issues to be discussed include solder paste selection, optimum PCB pad size, stencil aperture design, nozzle selection, solder paste printing and component placement accuracy requirements, reflow oven profile, inspection, rework, lead-free materials, etc.
After the presentation, FINETECH and MARTIN will feature hands-on demonstrations in its lab for the following processes:
- QFN rework paste printing, pre-bumping and soldering
- BGA reballing
- 0201/01005 small passive rework
For more information about the SMTA Boston Chapter, visit http://www.smta.org. For more information about FINETECH, visit http://www.finetechusa.com. For Martin, visit http://www.martin-smt.de.
FINETECH is a leading manufacturer of innovative rework and advanced packaging and assembly equipment for the latest advanced packages. The modular design of the FINEPLACER® platform enables a multitude of applications, from reworking SMDs to the highly accurate placement of flip chips or opto-electronic components. FINETECH is headquartered in Berlin, Germany, with offices in Tempe, Arizona; Manchester, New Hampshire; Shanghai, China; and Penang, Malaysia.
MARTIN has developed affordable rework, reballing, hand soldering, and dispensing technologies for nearly 30 years. The USA sales and service office is located in Manchester, NH. The company‘s manufacturing facility is in Wesseling, Germany. MARTIN is a FINETECH company.
