May 19, 2011 
On September 29, 2011, Finetech will hold the 8th International User Meeting “Micro Assembly” in Berlin. This series of events aims at prospects, users and experts alike and has become a fixed point of the annual industry calendar, attracting a steadily growing number of visitors.
Like last year, the focus will be on trends and challenges in the micro assembly sector. The Finetech team will be supported by high-profile experts from industry and research, adding presentations about current and future technological developments and case studies.
Demanding laser applications, micro optics assembly, MEMS/MOEMS packaging or seminal chip to wafer applications are some of the topics of practical relevance to be highlighted. Additionally, open discussion sessions will give opportunities for dialog and exchange.
The meeting will be conclude with a practical part in which the participants will be introduced to the latest FINEPLACER® bonding solutions and have the chance to get a hands-on impression. All visitors also are invited to spend the evening together having dinner and enjoying one of the many cultural attractions Berlin has to offer.
On Friday, September 30, interested visitors can make individual appointments with Finetech experts to get advice on specific projects.
Registration for the 8th International User Meeting Micro Assembly in Berlin is available at http://www.finetech.de/usermeeting. Check back regularly prior to the event to find the latest information and updates.
Finetech is a leading manufacturer of equipment for manual and fully automatic circuit board repair and high-precision insertion of electronic/optical components, plus assembly and fitting of complex opto-electronic systems.
