Christopher Associates’ Jasbir Bath to Present SMTA Webinar on Head-in-Pillow Defects

January 2010 ? Christopher Associates, a pioneering supplier to the electronics manufacturing industry, announces that Jasbir Bath, Consulting Engineer with Christopher Associates/Koki Solder, will host a SMTA-sponsored Webinar titled “Reducing Head-in-Pillow with Tin/Lead and Lead-Free Solder Paste Development.” The Webinar will be held on Thursday, February 4, 2010 at 11 a.m. USA Eastern/8 a.m. USA Pacific time, and will run for approximately 60-90 minutes with a question and answer period.

Head-in-Pillow defects have been found to cause a large percentage of failures in the reflow soldering of BGA/ CSP packages, especially in fine-pitch applications. In addition to reviewing the causes and solutions for Head-in-Pillow defects, Mr. Bath will discuss contributing factors, chemistry and process optimization related to the issue.

Mr. Bath is recognized as one of the leading experts on solder paste processing, and has been working on this challenging issue with a range of industry experts.

Further information, along with registration details can be found on the SMTA Web site at http://smta.org/education/presentations/presentations.cfm#hip or by visiting http://smta.org.

For further information, please visit http://www.christopherweb.com or contact:

Roberto Segura

Business Development Manager

Christopher Associates Inc.

3617 W. MacArthur Blvd.

Santa Ana, CA 92704

E mail: Roberto@christopherweb.com

Tel: 714-979-7500