Jun 17, 2024 
PEMTRON is excited to announce its participation in SEMICON West, the premier event for the semiconductor manufacturing industry. Taking place from July 9-11, 2024 at the Moscone Center in San Francisco, California, PEMTRON will discuss its innovative inspection systems at #booth 865.
At SEMICON West, PEMTRON will spotlight three of its advanced inspection systems: MARS, APOLLON and 8800WIR. These systems are revolutionizing quality control and yield improvement in semiconductor manufacturing.
The MARS system is a high-speed memory module AVI (Automated Visual Inspection) system, renowned for its precision and reliability even in challenging environments. With advanced image processing technology, MARS delivers accurate inspection results at remarkable speeds.
For package inspection, PEMTRON offers the APOLLON system, designed to accommodate a wide range of packages including BGA, LGA, QFN, QFP, CSP, and SOP. APOLLON's real-time defect identification and automated reporting capabilities enhance efficiency and minimize downtime for manufacturers.
Additionally, PEMTRON will showcase the 8800WIR wafer inspection system, which utilizes advanced 2D and 3D imaging technologies to inspect various types of bumps, including micro bumps. This system plays a crucial role in identifying and addressing quality issues throughout the semiconductor manufacturing process.
Visitors to PEMTRON's booth can experience live demonstrations of these cutting-edge inspection systems on monitors featuring videos of the equipment in action. Don't miss the opportunity to learn more about how PEMTRON's solutions are shaping the future of semiconductor inspection. Visit booth #865 at SEMICON West to explore the MARS, APOLLON, and 8800WIR systems firsthand and discover how they can elevate your manufacturing operations.
For more information about PEMTRON, visit https://pemtron.com/.
Based on 3D precision measurement and vision source technology, PEMTRON develops equipment used in various fields such as SMT, Automotive Field, Lead Tab, Semiconductor, and supplies
Soldering Inspection equipment (3D SPI), 3D Mounting Inspection equipment (3D AOI, MOI), Conformal Coating Inspection equipment (TROI-8800 CI), Bottom Head Inspection equipment (Eagle 8800TH), Top & Bottom Double Sided Simultaneous Inspection equipment (Eagle 8800TWIN), Automated X-Ray SMD Counter (MERCURY), Wafer Sawing Before/After 3D Inspection equipment (8800 WI/WIR), Wire Bonding 3D Inspection & MEMS Auto Inspection equipment(ZEUS), Package AVI equipment (APOLLON), Memory Module / SSD Auto Inspection equipment (MARS), FC-BGA, FCP-CSP Inspection equipment (POSEIDON-S), Scale Sorter Of FC-BGA Products (8800 FI), Bump Metal Mask Inspection equipment (8800 MI), PCB Appearance Inspection equipment (8800 AI) and Lead Tab Process/Inspection equipment(Hawk 7300).
