Aug 19, 2024 
PEMTRON is pleased to announce plans to exhibit at SMTA Guadalajara, scheduled to take place Sept. 11-12, 2024 at the Expo Guadalajara, Salón Jalisco Hall D & E. PEMTRON will exhibit in Booth 322, focusing on its groundbreaking D2 (Dual Lane & Dual Head) Series AOI and SPI system.
The D2 introduces dual lanes and dual heads, allowing for the simultaneous inspection of two different PCBs, setting a new benchmark for inspection technology. This innovative capability enables the system to inspect diverse boards concurrently, such as 8way + 4way, 12way + 4way, and 8way + 8way configurations.
In addition to its advanced capabilities, the D2 System boasts a user-friendly interface with a sophisticated design. It includes a built-in library management system and an offline real-time debug station, making it easy to operate and manage. The system's customizable design allows adjustments based on various inspection objects, reflecting thoughtful and well-engineered design principles.
Engineered for reliable performance, the D2 System features tele-centric lenses, high-speed CPUs, and advanced image processing capabilities, ensuring consistent and dependable operation.
Visit PEMTRON at Booth 322 during SMTA Guadalajara 2024 to experience the innovative D2 Series. Discover how PEMTRON's advanced inspection solutions can enhance your productivity, flexibility and overall manufacturing efficiency.
For more information about PEMTRON and its range of products, please visit www.pemtron.com.
Based on 3D precision measurement and vision source technology, PEMTRON develops equipment used in various fields such as SMT, Automotive Field, Lead Tab, Semiconductor, and supplies
Soldering Inspection equipment (3D SPI), 3D Mounting Inspection equipment (3D AOI, MOI), Conformal Coating Inspection equipment (TROI-8800 CI), Bottom Head Inspection equipment (Eagle 8800TH), Top & Bottom Double Sided Simultaneous Inspection equipment (Eagle 8800TWIN), Automated X-Ray SMD Counter (MERCURY), Wafer Sawing Before/After 3D Inspection equipment (8800 WI/WIR), Wire Bonding 3D Inspection & MEMS Auto Inspection equipment(ZEUS), Package AVI equipment (APOLLON), Memory Module / SSD Auto Inspection equipment (MARS), FC-BGA, FCP-CSP Inspection equipment (POSEIDON-S), Scale Sorter Of FC-BGA Products (8800 FI), Bump Metal Mask Inspection equipment (8800 MI), PCB Appearance Inspection equipment (8800 AI) and Lead Tab Process/Inspection equipment(Hawk 7300).
