Jan 20, 2012 
MARTIN will showcase its MINIOVEN Reball/Prebump unit, Expert 10.6 rework system and Clever Dispense unit at the upcoming IPC APEX Expo, scheduled for February 28 - March 1, 2012 at the San Diego Convention Center in California.
The MINIOVEN 04 provides a reflow environment in a compact, stand-alone unit and is ideal for pre-bumping QFNs and reballing BGAs and CSPs. The efficient hot gas circulation ensures optimal heating of the component and a controlled reflow process. The unit offers programmable modes and a nitrogen process gas supply. Up to 99 profiles can be accommodated, with the ability to edit individual profiles and fine tune parameters.
Also to be demonstrated at the show, the cost-effective Expert 10.6 IV rework system developed and configured for cell phone and small board requirements. The small board platform combines both infrared and convection heating technologies to achieve outstanding board and SMD temperature uniformity. Showing for the first time, a newly designed under-board component cooling device. This “one of a kind” cooling device keeps delicate devices from overheating, which can be caused by placement proximity of the top device being removed and extremely thin PCBs.
The Clever Dispense 05 is a manual, table top unit that dispenses a variety of materials across a wide range of viscosities. The unit precisely delivers dots and lines – featuring temperature compensation, fill level compensation and snuff back vacuum.
For further information, visit MARTIN in Finetech Booth #3020 at the show or online at www.bgarework.com.
MARTIN has developed affordable rework, BGA reballing, hand soldering, and dispensing technologies for nearly 30 years. The USA sales and service office is located in Manchester, NH. The company‘s manufacturing facility is in Wesseling, Germany. MARTIN is a FINETECH company.
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