Sep 30, 2013 
Photo Stencil will present the paper, Print Performance Studies Comparing Electroform and Laser-cut Stencils, at SMTA International 2013, Fort Worth, TX, on October 16, 2013. Written by Rachel Miller Short and William E. Coleman Ph.D., of Photo Stencil, and Joseph Perault, of Parmi, the paper fully evaluates various stencil types available in the industry today to determine which provide the best paste release results for small apertures while providing enough solder paste volume for normal-sized SMT components. The study includes a comparison of laser-cut electroformed blank foils as an alternative to normal electroformed stencils, and, in addition to electroformed stencil variations, evaluated various coatings and post processed stencils.
"As components get smaller, it is difficult to print solder paste to satisfy the requirements of both very small components, such as .4 and .3mm pitch CSPs, as well as normal SMT components," explained Rachel Short, VP sales and marketing, Photo Stencil. "The large components require more solder paste volume for sufficient solder fillets after reflow; however, if the stencil normally used to print solder paste for SMT components is used for the small components, the apertures are so small that poor paste release may be encountered. The area ratio plays a large part in this dilemma. Our study details the performance of 12 stencils in 5 different categories."
The paper will be presented at SMTA International in a free session, Spotlight Session 4, on Wednesday, October 16 th, 2013, from 9:30-11:00 AM, at the Fort Worth Convention Center, Fort Worth, TX.
For more information, contact Photo Stencil at info@photostencil.com or visit the Photo Stencil website at www.photostencil.com
