Jul 10, 2023 ZESTRON is excited to announce an upcoming webinar titled, "Enhancing Yield and Reliability of Ultra-Fine Pitch Die through Defluxing on CoWs" on July 20th, 2023, at 2:00 PM EST.
This informative webinar will focus on the critical step of defluxing ultra-fine pitch die on chip-on-wafer (CoW) packages in the manufacturing process of microelectronics. The study will be presented by Ravi Parthasarathy, Senior Application Engineer at ZESTRON Americas, who will discuss the challenges presented by the small size and close proximity of the interconnects on CoW packages.
Mr. Parthasarathy will investigate the appropriate cleaning solution and process parameters required to effectively remove the flux residues without damaging the delicate interconnects on CoW packages with a 10µm bump pitch and 10µm gap height between a top die and bottom silicon wafer. The study will provide valuable insights into the defluxing process, enabling the production of high-quality microelectronics with improved reliability and performance.
This webinar is a must-attend for engineers, quality control personnel, and other professionals involved in the manufacturing of microelectronics. Participants will have the opportunity to ask questions and receive expert guidance from Mr. Parthasarathy, as well as gain valuable insights into the latest defluxing technologies and best practices for optimal performance.
Registration is free and available HERE. Don't miss this opportunity to learn from one of the industry's leading experts on defluxing ultra-fine pitch die on CoW packages.
ZESTRON is headquartered in Manassas, Virginia, and operates in more than 35 countries. With eight technical centers worldwide and the industry’s most knowledgeable team of engineers focused on high-precision cleaning, ZESTRON’s commitment to ensuring that its customers surpass even the most stringent cleaning requirements is without equal.
For additional information or to tour one of our technical centers, please visit www.zestron.com
