News Releases from Nihon Superior Co., Ltd.
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163 news releases added by Nihon Superior Co., Ltd.
Company Information:
Nihon Superior’s President Tetsuro Nishimura to Present at INTERNEPCON JAPAN 2011
Jan 18, 2011 | Nihon Superior Co. Ltd. announces that company President Tetsuro Nishimura will present a paper titled “Recent Developments in the Application of Sn-Cu-Ni+Ge Lead-free Solder and Halogen-free Fluxes” at the upcoming INTERNEPCON JAPAN, scheduled to take place January 19-21, 2011 at the Tokyo Big Sight in Tokyo, Japan.
Nihon Superior to Exhibit Advanced Soldering Materials at INTERNEPCON JAPAN 2011
Jan 14, 2011 | Nihon Superior Co. Ltd. will exhibit in Booth # East 30-14 at the upcoming INTERNEPCON JAPAN, scheduled to take place January 19-21, 2011 at the Tokyo Big Sight in Tokyo, Japan.
Nihon Superior Named Best Company in 2010 by Osaka Monodzukuri Spirit Awards
Dec 09, 2010 | Nihon Superior announces that it has been awarded a Best Company Award in the 2010 Osaka Monodzukuri Award program. The award will be officially presented at a ceremony that will take place at the Osaka Labour Center on January 11, 2011.
Nihon Superior’s SN100C P602 Wins Prestigious Global Technology Award
Oct 27, 2010 | Nihon Superior Co. Ltd., a supplier of advanced soldering materials to the global market, announces that it has been awarded a Global Technology Award in the category of Environmentally Friendly Products/Services for its SN100C P602 Solder Paste.
Nihon Superior’s NS-F900 Honored with a 2010 Global Technology Award
Oct 27, 2010 | Nihon Superior Co. Ltd., a supplier of advanced soldering materials to the global market, announces that it has been awarded a Global Technology Award in the category of Flux for its NS-F900 Halogen-free Flux for Wave Soldering.
Nihon Superior to Highlight Advanced Soldering Materials at SMTAI 2010
Oct 04, 2010 | Nihon Superior Co. Ltd., a supplier of advanced soldering materials to the global market, announces that it will highlight its SN100C P602 Solder Paste and NS-F900 Wave Soldering Flux in booth 226 at the upcoming SMTA International exhibition, scheduled to take place October 26-27, 2010 at the Walt Disney World Swan and Dolphin Resort in Orlando, FL.
Nihon Superior’s Keith Sweatman to Present at SMTAI 2010
Oct 01, 2010 | Nihon Superior Co. Ltd., a supplier of advanced soldering materials to the global market, announces that Keith Sweatman will present a paper titled “The Development of an Improved Tin-Zinc Solder” at the upcoming SMTA International
Nihon Superior Releases Video Results for Evaluation of SN100C and SAC305
Sep 14, 2010 | Nihon Superior Co. Ltd., a supplier of advanced soldering materials to the global market, has released a video demonstrating the results of an evaluation comparing the wettability and spreadability of SN100C and SAC305 solder alloys on stranded wire.
Nihon Superior Wins ICEP Outstanding Paper Award
Sep 02, 2010 | Nihon Superior Co. Ltd., a supplier of advanced soldering materials to the global market, announces that the research it sponsored at the University of Queensland, Australia provided the basis for the paper that earned an ICEP Outstanding Paper Award.
Nihon Superior’s SN100C Wets and Spreads Faster than SAC305
Sep 01, 2010 | Nihon Superior Co. Ltd., a supplier of advanced soldering materials to the global market, announces that SN100C wets and spreads faster than SAC305.
Nihon Superior’s Keith Howell to Present at International Conference on Soldering and Reliability
May 05, 2010 | OSAKA, JAPAN — Nihon Superior Co. Ltd., a supplier of advanced soldering materials to the global market, announces that Keith Howell will present a paper titled “Effect of Soldering Method and Flux Type on Whisker Growth in SAC305” at the upcoming International Conference on Soldering and Reliability (ICSR), which is co-located with the Lead-Free Academy and SMTA Toronto Expo and Tech Forum.
Nihon Superior’s SN100C (040) Wins a 2010 Innovation Award
Apr 22, 2010 | OSAKA, JAPAN - Nihon Superior Co. Ltd. announces that it has been awarded a 2010 EMAsia Innovation Award in the category of Environmentally Friendly Products/Materials for its completely halogen-free lead-free flux-cored solder wire SN100C (040). The award was presented to the company during an April 21, 2010 ceremony that took place at the Shanghai Everbright Convention & Exhibition Center during NEPCON China 2010.
Nihon Superior's SN100C (040) Wins a 2010 SMT VISION Award
Apr 11, 2010 | OSAKA, JAPAN - Nihon Superior Co. Ltd. announces that it has been awarded a 2010 SMT VISION Award in the category of Soldering Materials for its completely halogen-free lead-free flux-cored solder wire SN100C (040).
Nihon Superior's Keith Sweatman to Present at APEX 2010
Mar 30, 2010 | OSAKA, JAPAN - Nihon Superior Co. Ltd., a supplier of advanced soldering and brazing materials to the global market, announces that Keith Sweatman will present a paper titled "Effect of Soldering Method, Temperature, and Humidity on Whisker Growth in the Presence of Flux Residues" at the upcoming IPC/APEX conference and exhibition.
Nihon Superior to Highlight a Complete Suite of SN100C Soldering Materials at APEX 2010
Mar 26, 2010 | OSAKA, JAPAN - Nihon Superior Co. Ltd., a supplier of advanced soldering materials to the global electronics industry, announces that it will display a full range of products based on its unique lead-free solder SN100C in booth 1426 at the upcoming IPC/APEX conference and exhibition.
Nihon Superior Opens News Office in Indonesia
Feb 08, 2010 | OSAKA, JAPAN — February 2010 — Nihon Superior Co. Ltd., a supplier of advanced soldering materials to the global electronics industry, announces that its subsidiary Nihon Superior (Singapore) Pte. Ltd. is opening a representative office in Indonesia on February 8, 2010.
Nihon Superior’s Keith Sweatman to Present at TMS 2010
Feb 08, 2010 | OSAKA, JAPAN — February 2010 — Nihon Superior Co. Ltd., a supplier of advanced soldering and brazing materials to the global market, announces that Keith Sweatman will present a paper titled “The Relationship between Whisker Growth and Corrosion in Sn-3.0Ag-0.5Cu” at the upcoming TMS 2010 Annual Meeting & Exhibition, scheduled to take place February 14-18, 2010 at the Washington State Convention Center in Seattle.
Nihon Superior to Highlight a Complete Suite of SN100C Soldering Materials at INTERNEPCON Japan 2010
Jan 17, 2010 | OSAKA, JAPAN — January 2010 — Nihon Superior Co. Ltd., a supplier of advanced soldering materials to the global electronics industry, announces that it will display a full range of products based on its unique lead-free solder SN100C in Booth # East 31-12 in the East 6 Hall of East Exhibit Building at the upcoming INTERNEPCON Japan 2010, scheduled to take place January 20-22, 2010 at the Tokyo Big Site.
Nihon Superior’s SN100C P600 D4 Halogen-Free, No-Clean, Lead-free Solder Paste to Debut at Productronica
Dec 07, 2009 | OSAKA, JAPAN — October 2009 — Nihon Superior Co. Ltd. announces that it will debut its SMT VISION Award winning SN100C P600 D4 Solder Paste in Hall A4, Stand 570 at Productronica. The event is scheduled to take place 10th – 13th November 2009 at the New Munich Trade Fair Center in Munich, Germany.
iNEMI Recognizes Tetsuro Nishimura for Nihon Superior’s Extraordinary Support of iNEMI Activities
Nov 19, 2009 | OSAKA, JAPAN — November 2009 — Nihon Superior Co. Ltd., a supplier of advanced soldering materials to the global electronics industry, announces that the Board of Directors of the International Electronics Manufacturing Initiative (iNEMI) has recognized Tetsuro Nishimura, President of Nihon Superior, for his company’s generous support of several iNEMI projects.
Nihon Superior’s SN100C P600 D4 Paste Wins a 2009 Global Technology Award
Nov 11, 2009 | OSAKA, JAPAN — November 2009 — Nihon Superior Co. Ltd. announces that it has been awarded a 2009 Global Technology Award in the category of Soldering Materials for its SN100C P600 D4 Solder Paste. The award was presented to the company during a Tuesday, November 10, 2009 ceremony that took place at the New Munich Trade Fair Center in Munich, Germany.
Nihon Superior to Highlight a Complete Suite of SN100C Soldering Materials at SMTA Southeast Asia Technical Conference 2009
Nov 02, 2009 | OSAKA, JAPAN — November 2009 — Nihon Superior Co. Ltd., a supplier of advanced soldering materials to the global electronics industry announces that it will display a full range of products based on its unique lead-free solder SN100C in its booth at the SMTA Southeast Asia Technical Conference on Electronics Assembly Technologies at the Equatorial Hotel in Penang, Malaysia, November 18-20, 2009.
Nihon Superior to Highlight SN100C Products at SMTAI 2009
Sep 17, 2009 | OSAKA, JAPAN — September 2009 — Nihon Superior Co. Ltd., an advanced soldering and brazing supplier to the worldwide market, announces that it will showcase a new, expanded range of SN100C products in booth 624 at the upcoming SMTA International, scheduled to take place October 6-7, 2009 at The Town and Country Resort and Convention Center in San Diego, CA.
Nihon Superior’s SN100C University Research Recognized
Sep 17, 2009 | OSAKA, JAPAN — September 2009 — Nihon Superior Co. Ltd., a supplier of advanced soldering and brazing materials to the global market, announces that research sponsored by the company was recognized by the University of Queensland as one of the best examples of a successful cooperation between the university and the industry.
Nihon Superior Debuts New Lead-Free Presentation
Jul 28, 2009 | OSAKA, JAPAN — July 2009 — Nihon Superior Co. Ltd., a supplier of advanced soldering and brazing materials to the global market, announces that a new presentation about the challenges and issues in lead-free soldering is now available on the company’s Web site.
Nihon Superior Receives SN100C 10-Year Anniversary Plaque at NEPCON China 2009
May 11, 2009 | OSAKA, JAPAN � May 2009 � Nihon Superior Co. Ltd., an advanced soldering and brazing supplier to the global market, announces that Nihon Superior was awarded a plaque in honor of the company's 10th anniversary of its SN100C lead-free solder alloy. The award was presented by Reed China during the recent NEPCON China exhibition and conference that took place in Shanghai, China.
Nihon Superior Receives SN100C 10-Year Anniversary Plaque at NEPCON China 2009
May 11, 2009 | OSAKA, JAPAN � May 2009 � Nihon Superior Co. Ltd., an advanced soldering and brazing supplier to the global market, announces that Nihon Superior was awarded a plaque in honor of the company's 10th anniversary of its SN100C lead-free solder alloy. The award was presented by Reed China during the recent NEPCON China exhibition and conference that took place in Shanghai, China.
Nihon Superior's SN100C P600 D4 Paste Wins a 2009 SMT VISION Award
Apr 08, 2009 | OSAKA, JAPAN � April 2009 � Nihon Superior Co. Ltd. announces that it has been awarded a 2009 SMT VISION Award in the category of Environmentally Friendly Products & Services for its SN100C P600 D4 Solder Paste. The award was presented to the company during a Monday, March 30, 2009 ceremony that took place in the Mandalay Bay Resort & Convention Center in Las Vegas before the start of APEX 2009.
Nihon Superior's NS-F850 Wins a 2009 NPI Award
Apr 08, 2009 | OSAKA, JAPAN � March 2009 � Nihon Superior announces that it has been awarded a NPI Award in the category of Flux for its NS-F850. The award was presented to the company during a Monday, March 30, 2009 ceremony that took place in the Mandalay Bay Resort & Convention Center in Las Vegas before the start of APEX 2009.
Nihon Superior's Keith Sweatman to Present at APEX 2009
Mar 12, 2009 | OSAKA, JAPAN � March 2009 � Nihon Superior Co. Ltd., a supplier of advanced soldering and brazing materials to the global market, announces that Keith Sweatman, Nihon Superior Co. Ltd.'s Senior Technical Advisor, will present a paper titled �Hot Air Solder Levelling in the Lead-free Era� at the upcoming APEX Conference and Exhibition. The presentation will take place during Session 28, titled Surface Finishes, on Thursday, April 2, 2009 from 9-10 a.m.
Nihon Superior to Premier New SN100C Products at APEX 2009
Mar 10, 2009 | OSAKA, JAPAN � March 2009 � Nihon Superior Co. Ltd., a supplier of advanced soldering and brazing materials to the global market, announces that it will showcase a new, expanded range of SN100C products in booth 2564 at the upcoming APEX exhibition and conference, scheduled to take place March 31-April 2, 2009, in Las Vegas.
Nihon Superior's High Ductility Lead-free Solder Provides High Impact Strength
Mar 06, 2009 | OSAKA, JAPAN � March 2009 � Nihon Superior Co. Ltd., a supplier of advanced soldering and brazing materials to the global market, announces SN100C high ductility lead-free solder provides high impact strength. A high ductility solder alloy can absorb more energy during impact than an alloy with high tensile strength but is brittle.
Nihon Superior Introduces Lead-free Solder Paste for 0402 Metric Chip Components
Mar 05, 2009 | OSAKA, JAPAN � March 2009 � Nihon Superior Co. Ltd., a supplier of advanced soldering and brazing materials to the global market, announces the development of SN100C P520 D5 lead-free solder paste for 0402 metric chip components.
Nihon Superior's SN100C (030) Provides Sharp Spread and Good Separation
Mar 01, 2009 | OSAKA, JAPAN � February 2009 � Nihon Superior Co. Ltd., a supplier of advanced soldering and brazing materials to the global market, announces Extra Fine Solder Wire SN100C (030) provides sharp spreading and good separation.
Nihon Superior Premiers SN100C High-Reliability Lead-Free Solder Spheres
Jan 23, 2009 | OSAKA, JAPAN � January 2009 � Nihon Superior Co. Ltd., an advanced soldering and brazing supplier to the worldwide market, introduces SN100C high-reliability lead-free solder spheres.
Nihon Superior Introduces NS-F850 Flux for Lead-Free Wave Soldering
Jan 23, 2009 | OSAKA, JAPAN � January 2009 � Nihon Superior Co. Ltd., an advanced soldering and brazing supplier to the worldwide market, introduces NS-F850 rosin-based flux for lead-free wave soldering.
Nihon Superior Debuts SN100C(510) Lead-Free Flux Cored Solder Wire
Jan 22, 2009 | OSAKA, JAPAN � January 2009 � Nihon Superior Co. Ltd., an advanced soldering and brazing supplier to the worldwide market, introduces SN100C(510) lead-free flux cored solder wire.
Nihon Superior Introduces SN100C P800 Power Semiconductor Lead-Free Solder Paste
Jan 21, 2009 | OSAKA, JAPAN � January 2009 � Nihon Superior Co. Ltd., an advanced soldering and brazing supplier to the worldwide market, introduces SN100C P800 power semiconductor lead-free solder paste.
Nihon Superior to Showcase Newly Expanded Range of SN100C Soldering Materials at Mexitr�nica 2008
Oct 07, 2008 | OSAKA, JAPAN � October 2008 � Nihon Superior USA, a subsidiary of Nihon Superior Co. Ltd., an advanced soldering supplier to the worldwide market, announces that it will feature a newly expanded range of SN100C products, which includes new halogen-free solder paste, in booth 402 at the upcoming Mexitr�nica exhibition, scheduled to take place October 21-23, 2008 at the Expo Guadalajara, Hotel Hilton, in Guadalajara, Jalisco, M�xico.
Nihon Superior to Display Complete Range of SN100C Soldering Materials at SMTA International 2008
Aug 07, 2008 | Nihon Superior will feature a new, expanded range of SN100C products with FCT Assembly, one of its US SN100C Global Partners, in booth 125 at the upcoming SMTA International exhibition and conference.
Nihon Superior to Participate in SMTA International 2008
Aug 07, 2008 | OSAKA, JAPAN � August 7, 2008 � Nihon Superior Co. Ltd., an advanced soldering and brazing supplier to the worldwide market, announces that it will present during the technical conference as well as exhibit at the upcoming SMTA International Conference & Exhibition, scheduled to take place August 17-21, 2008 at Disney's Coronado Springs Resort in Orlando, FL.
Nihon Superior Singapore Celebrates 20th Anniversary
May 12, 2008 | OSAKA, JAPAN � May 7, 2008 � Nihon Superior Co. Ltd., an advanced soldering and brazing supplier to the worldwide market, announces that the Nihon Superior Trading (S) Pte., Ltd. subsidiary is entering its 20th year of business. The anniversary will be celebrated on May 24th in Singapore.
Two Industry Names Carry on Family Tradition
May 06, 2008 | OSAKA, JAPAN � May 5, 2008 � This past April, at the recent 2008 APEX show in Las Vegas, two families with two generations in the electronics assembly industry were introduced to each other. Tetsuro Nishimura, the President of Nihon Superior and inventor of the SN100C lead-free alloy, introduced his father, Toshiro Nishimura, founder of Nihon Superior in 1966 after many years in the electronics industry, to Charlie Lynch.
Nihon Superior to Present �Tin, The Essential Ingredient in Lead-Free Solder � But Do You Also Need Silver?� at the 2008 International Tin Conference
Apr 10, 2008 | OSAKA, JAPAN � April 9, 2008 � Nihon Superior Co. Ltd., an advanced soldering and brazing supplier to the worldwide market, announces that it will present at the International Tin Conference, scheduled to take place April 14-17, 2008 at the Intercontinental Hotel in Hong Kong.
Nihon Superior�s SN100C Wins 2008 SMT China Vision Award
Apr 09, 2008 | OSAKA, JAPAN � April 2008 � Nihon Superior Co. Ltd., an advanced lead-free soldering materials to the global electronics industry announces that it has been awarded 2 2008 SMT China Vision Award with Balver Zinn in the category of Soldering Materials for its innovative SN100C Paste.
Nihon Superior to attend 18th Shanghai International SMT Conference
Apr 08, 2008 | OSAKA, JAPAN � March 4, 2007 � Nihon Superior Co. Ltd., a supplier of advanced lead-free soldering materials to the global electronics industry announces that it is contributing a paper, �Impact Strength of Lead-free BGA Spheres,� to the 18th Shanghai International SMT High Level Conference that is part of NEPCON China 2008 which is scheduled to take place from April 8 to April 11, 2008 at Shanghai Everbright Convention and Exhibition Centre.
Nihon Superior�s SN100C Wins Two 2008 NPI Industry Awards
Apr 07, 2008 | OSAKA, JAPAN � March 31, 2008 � Nihon Superior Co. Ltd., an advanced lead-free soldering materials to the global electronics industry announces that it has been awarded two 2008 NPI Awards with the Balver Zinn Balver Zinn Group (Balver Zinn, Nihon Superior Co. Ltd., FCT Assembly and DKL Metals) in the category of Soldering Materials and Flux for its innovative SN100C Paste. The awards were presented to the company during a Monday, March 31, 2008 ceremony that took place in the Mandalay Bay Resort & Convention Center in Las Vegas before the start of APEX 2008.
What's happening at Nihon Superior in 2008?
Mar 25, 2008 | Comment from Tetsuro Nishimura, North American Sales Manager
Nihon Superior Paper on Lead-free Solder Properties at APEX 2008
Mar 20, 2008 | OSAKA, JAPAN � March 2008 � Nihon Superior Co. Ltd., a supplier of advanced lead-free soldering materials to the global electronics industry announces that it is contributing a paper, �Properties that are Important in a Lead-free Solder,� to the Technical Conference that is part of the Printed Circuit Expo, APEX and the Designers� Summit scheduled to take place April 1-3, 2008 at the Mandalay Bay Resort & Convention Center, Las Vegas.
Nihon Superior to Introduce Complete Range of SN100C Soldering Materials at APEX 2008
Mar 15, 2008 | OSAKA, JAPAN � March 2008 � Nihon Superior USA, a subsidiary of Nihon Superior Co. Ltd., an advanced soldering supplier to the worldwide market, announces that it will showcase a new, expanded range of SN100C products in booth 249 at the upcoming APEX exhibition and conference, scheduled to take place April 1-3, 2008 in Las Vegas.
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