SMT, PCB Electronics Industry News
  • SMTnet
  • »
  • Industry News
  • »
  • A-Laser Releases New LDS Capability for Manufacturing 3D Circuitry

A-Laser Releases New LDS Capability for Manufacturing 3D Circuitry

Sep 18, 2014

molded interconnect device (MID)

molded interconnect device (MID)

FCT Assembly introduces the A-Laser Division’s new laser direct structuring (LDS) capability. The introduction of laser direct structuring (LDS) has revolutionized the molded interconnect device (MID) market, bringing flexibility to design, enhancing product capability and often at a significant cost savings.

A-Laser’s vast experience with laser systems and plating processes combined with their engineering team’s knowledge in injection moulding enables the company to offer innovative parts developed with quality and efficiency. Quite often, there are three components to the development process for manufacturing LDS 3-D circuits. Prototypes are developed with LPKF’s proprietary proto-paint process in combination with a raw part from virtually any plastic. Next, the manufacturing industry has seen a number of innovations in the realm of 3-D printed parts through advancements in materials and printing technology. Due to the quick turn nature of this process; cycle times can be greatly reduced in the development phase. Lastly, mold injected parts, from LDS grade materials, can be brought to full-scale production.

We are very excited to be at the forefront of the MID market in the Untied States”, says Josh Saunders, President of the A-Laser Division. “Our focus on high quality parts and excellent service will serve us well as we step into this cutting-edge market.”

MIDs provide enormous technical and economic potential while offering improved ecological behavior in comparison to conventional printed circuit boards. MIDs complement circuitry that would be impossible to achieve with other technologies. In the LDS process, a part is normally made from a plastic material containing an LDS additive. The laser etches conductive trace structures onto any properly designed surface. Initially copper, then nickel and gold layers are built up on these structures in a subsequent metallization bath.

From prototypes to production, A-Laser guides customers through the entire project. The engineering department excels in design, while also keeping in mind process implementation and cost reduction goals. Further, LPKF has created a design guide ( allowing optimization opportunities from the onset. For more information about A-Laser’s LDS capability, visit
For more information about A-Laser’s advanced technology, visit

A-Laser is a premier precision parts manufacturer, providing consistent, high quality laser services for a wide range of industries. Specializing in the processing of ultra-thin materials, our technicians provide solutions for your most challenging applications.For more information, visit

Feb 04, 2015 -

What You Will Learn from A-Laser MID Tech Day

Jan 27, 2015 -

MacAllister and Associates Joins A-Laser’s Rep Team

Jan 25, 2015 -

A-Laser Announces Speakers for MID Tech Day

Jan 08, 2015 -

A-Laser to Host Technical Event in California

Nov 25, 2014 -

A-Laser to Highlight New Capability for the MID Market at the BIOMEDevice Show

Apr 05, 2013 -

A-Laser to Highlight Custom Laser Marking Capability at the Del Mar Show

Jan 10, 2013 -

A-Laser to Highlight Custom Laser Marking Capability at MD&M West

Sep 27, 2012 -

A-Laser to Discuss Custom Laser Cutting Services at MD&M Minneapolis

Sep 20, 2012 -

A-Laser to Exhibit at Design-2-Part in Marlborough, MA

Aug 10, 2012 -

Josh Saunders Takes the Lead at A-Laser as Company President

16 more news from A-Laser, Inc. »

Jun 15, 2019 -

Engineered Material Systems Introduces Durable Printed Electronics with SMT

Jun 13, 2019 -

The prerequisites for tomorrow's technologies

Jun 11, 2019 -

CyberOptics to Launch New AVLS3 with CyberSpectrum™ Software and New NanoResolution MRS Sensor at SEMICON West

Jun 11, 2019 -

Nordson ASYMTEK to Present Sessions on Conformal Coating Reliability and Stability at IPC WorksAsia 2019 Conferences in Guangzhou and Suzhou, China

Jun 11, 2019 -

KYZEN Showcases MICRONOX M2322 and MICRONOX M2708 at SEMICON West

Jun 10, 2019 -

The new fast dehumidifying dry cabinet series release

Jun 10, 2019 -

New Bob Willis Book Reviews

Jun 10, 2019 -

Our Defect of the Month Video

Jun 09, 2019 -

Specialty Coating Systems to Host Free Parylene Coatings Seminar

Jun 09, 2019 -

CheckSum Parallel Technology Reduces Inventory Pile-Ups

See electronics manufacturing industry news »

A-Laser Releases New LDS Capability for Manufacturing 3D Circuitry news release has been viewed 575 times

  • SMTnet
  • »
  • Industry News
  • »
  • A-Laser Releases New LDS Capability for Manufacturing 3D Circuitry
Rework Training Materials

Reflow Oven Profiler