ASC International, a leading manufacturer of 3-D solder paste inspection and automated optical inspection systems, today announced that its VisionPro HSi will be featured in Booth #140 at SMTA International, scheduled to take place September 27-28, 2016 at the Donald Stephens Convention Center in Rosemont, IL.
VisionPro HSi is a high-speed, sophisticated 3-dimensional solder paste measurement system coupled with an intuitive Windows® user interface, and packaged in a rugged, bench-top portable system designed for the electronics production floor. With only a few minutes training, an operator can perform accurate 100 percent - 3D measurements of solder paste pads, BGAs and many other PCB features. The VisionPro HSi automated solder paste measurement process eliminates operator errors and offers excellent measurement repeatability.
“We have found great success with the VisionPro HSi due to its ability to fully characterize the overall print of a PCB,” stated Steve Arneson, National Business Manager. “This valuable feedback is then used to make the proper correction actions to the print parameters and board supports to allow for a solid print process to exist.”
In addition to the VisionPro HSi, ASC International will demonstrate its industry-leading VisionPro M500 bench top SPI system, its unique SPI/AOI combination system called the LineMaster DM, and the Unicomp X-ray machine.
For more information about ASC International, visit www.ascinternational.com.