Jul 17, 2005
The PRO 8b selective laser soldering system provides an economical means to selective solder both tin lead and lead free alloys within minimal start up costs and on-going maintenance, lower power consumption, and reduce environmental impact. Since the diode laser can be precisely controlled, is highly repeatable, and provides a highly focused heating zone, operators have better control over the entire process and do not impart any additional heat to and around surrounding components. Due to the speed of the process, results yield a reduction in solder grain size and inter-metallic oxide formation, creating superior joint properties.
A distinguished panel of semiconductor industry experts evaluated each applicant�s products based on the company�s ability to meet a significant industry challenge; demonstrate a creative application of a new technology, quality of performance, economic merit and throughput results. PROMATION beat out many entrants from a list of the who�s who in the semiconductor packaging industry and is proud to have now won two APA awards (2004 and 2005) back to back. The Advanced Packaging awards ceremony took place at the Regency Center in San Francisco, California on July 13th.
About PROMATION, Inc. (www.pro-mation-inc.com)
PROMATION Inc. specializes in PCB handling solutions, robotic soldering systems, in-line automation, and technical work benches. The company�s enabling technologies provide it�s customers with reliable, innovative solutions for electronics manufacturing.
About Advanced Packaging Magazine: (www.apmag.com)
The Advanced Packaging Awards program has been the cornerstone for products and services within the semiconductor packaging industry that excel in innovation, cost savings and overall excellence. A panel of industry judges, independent of Advanced Packaging Magazine, selects the winners and tabulation of judges scores are handled by an independent third-party.
