Jul 29, 2014 Panasonic Factory Solutions Company of America’s new process-flexible, flip chip bonder garnered the interest of North American high-reliability manufacturers—from photonics to high frequency devices—at Semicon West 2014.
According to Mr. Tae Yi, Panasonic Factory Solutions Global Accounts Manager and Microelectronics Equipment Specialist, “We are experts in the thermosonic process for the SAW, TCXO, LED, and CMOS markets and already have many high-volume customers in Asia. Now, as affirmed at Semicon, this technology adoption and on-shoring is becoming a growing trend in North America. Because of our expertise, Panasonic can quickly help manufacturers in the Americas adopt thermosonic bonding and overcome process challenges.”
The company’s newest die bonder, the MDP-300, combines high accuracy C4 and C2 flip chip, thermosonic, and thermocompression processes into a single, small footprint bonder. Mr. Yi concluded: “Nearly all my conversations with customers over the three days of the show followed a continuous theme—process flexibility and high accuracy. Their interest increased when they learned that the MDP-300 can be in-line with a Panasonic SMT machine for a high-throughput, hybrid COB process solution."
The company also introduced the APX300 Plasma Dicer that can help customers solve critical yield challenges of singulation using Panasonic’s non-contact plasma technology. The platform is ideal for small, thin, and brittle dicing required by MEMS, Power, LED, and other markets.
Panasonic Factory Solutions Company of America, a North American source for electronic assembly equipment (SMT), software, and technical support, provides total business systems solutions for electronic semiconductor and packaging companies in the global marketplace through one provider. The company is a unit of Panasonic Corporation of North America, which is the principal North American subsidiary of Panasonic Corporation.
For additional information: Panasonic Factory Solutions Company of America, 5201 Tollview Drive, Rolling Meadows, IL 60008. PFSAmarketing@us.panasonic.com PH: 847.637.9600 www.panasonicfa.com
Editorial Contact: Kristin Serna (Media Relations) 847.637.9600 PFSAmarketing@us.panasonic.com
