SMT, PCB Electronics Industry News
  • SMTnet
  • »
  • Industry News
  • »
  • MacDermid Alpha Introduces Ultra-Fine Feature Solder Paste at Productronica China in Shanghai

MacDermid Alpha Introduces Ultra-Fine Feature Solder Paste at Productronica China in Shanghai

Mar 06, 2021

The Assembly Solutions division of MacDermid Alpha Electronics Solutions, a world leader in the production of electronics soldering and bonding materials, will introduce ALPHA® OM-372 its latest ultra-fine feature solder paste innovation at Productronica China at the Shanghai New International Expo Centre in Shanghai, China from March 17-19.

ALPHA OM-372 is designed to provide ultra-high electrochemical reliability on fine pitched, low standoff components.ALPHA OM-372is formulated to deliver low post reflow residue and superior transfer efficiency on fine feature pads as low as 80x130µm (008004). A combination of these best-in-class features as well as excellent HIP and NWO performance makes itideal for a broad range of high board density applications requiring smaller, thinner, and lighter form factor components.

MacDermid Alpha will also be promoting its latest ALPHAHiTech bonding materials including the newly launchedALPHA HiTech Underfill and Edgebond products featuring high Transition Glass Temperature (Tg), Low Coefficient Thermal Expansion (CTE), and excellent thermal cycling (TCT) performance. ALPHA Argomax®sintering process solutionsandnew technology for flexibleformable and printed electronics will also be featured.

For additional information about MacDermid Alpha's latest technologies and products, please visit Booth #E4-4702 at Productronica China, or visit MacDermidAlpha.com

Productronica China 2021
Date: March 17-19, 2021
Venue: Shanghai New International Expo Centre
Booth# E4-4702


Through the innovation of specialty chemicals and materials under our Alpha, Compugraphics, Kester and MacDermid Enthone brands, we provide solutions that power electronics interconnection.  We serve all global regions and every step of device manufacturing within each segment of the electronics supply chain. The experts in our Semiconductor Solutions, Circuitry Solutions, and Assembly Solutions divisions collaborate in design, implementation, and technical service to ensure success for our partner clients.  Our solutions enable our customers’ manufacture of extraordinary electronic devices at high productivity and reduced cycle time. Find out more at MacDermidAlpha.com.

Nov 27, 2023 -

MacDermid Alpha launches ALPHA® SF828-MBB photovoltaic liquid flux for advanced multi-busbar interconnections

Nov 20, 2023 -

Improve board level reliability by reducing solder joint voiding below 10%

Jun 26, 2023 -

MacDermid Alpha Electronics Solutions Expands Market Presence in Israel with New Channel Partnership

Oct 06, 2022 -

MacDermid Alpha to Present Automotive Traction Module Attach by Silver Sintering at IEMT Conference 2022

Oct 04, 2022 -

MacDermid Alpha to Present Next Generation Assembly & Interconect Technologies for 3D In-Mold Electronics at TechBlick 2022

Sep 19, 2022 -

MacDermid Alpha to Feature Latest Low Temperature Solutions at SMTA Guadalajara and SMTA Empire Expos

Sep 15, 2022 -

MacDermid Alpha Presents Technical Paper at SMTA Penang Chapter

Sep 08, 2022 -

MacDermid Alpha Introduces New Packaging Option for ALPHA® Argomax® Sinter Paste

Sep 05, 2022 -

MacDermid Alpha Exhibits Capabilities and Latest Technology at Semicon Taiwan

Aug 26, 2022 -

MacDermid Alpha to Promote High Reliability Assembly Solutions at EMS-Tag, Germany

38 more news from MacDermid Alpha Electronics Solutions »

May 06, 2024 -

Aven Introduces New 9 Piece E-Z Pik Tweezers Set for Precision Work

May 06, 2024 -

KYZEN to Highlight AQUANOX A4618 and ANALYST2 at SMTA Rocky Mountain Expo and Tech Forum

May 06, 2024 -

VJ Electronix Introduces New Cost-Effective X-ray Inspection Solution with Superior Performance

May 06, 2024 -

Kimchuk, Inc. Elevates Testing Capabilities with Seica PILOT V8 NEXT Flying Probe Tester

May 06, 2024 -

Electronics Industry Sentiment Rose in April, Hitting New High

May 06, 2024 -

IPC's letter to Congress.

May 06, 2024 -

Murray Percival Company Awarded Top Representative of 2023 by MIRTEC

May 06, 2024 -

ZESTRON Academy Launches 2024 Advanced Packaging & Power Electronics Webinar Series

May 06, 2024 -

Aven Partners with Industrial Source Inc. to Enhance Support for Industrial Distribution Partners

May 06, 2024 -

Seika Machinery Releases McDry Introduction Video Showcasing Innovative Dry Cabinets

See electronics manufacturing industry news »

MacDermid Alpha Introduces Ultra-Fine Feature Solder Paste at Productronica China in Shanghai news release has been viewed 767 times

  • SMTnet
  • »
  • Industry News
  • »
  • MacDermid Alpha Introduces Ultra-Fine Feature Solder Paste at Productronica China in Shanghai
Jade Series Selective Soldering Machines

Thermal Interface Material Dispensing