Seika Machinery to Debut Multi-Point Selective Soldering System at the IPC APEX Expo

Feb 03, 2012

Andes Solbot II Multi-Point Selective Soldering System

Seika Machinery, Inc., a leading provider of advanced machinery, materials and engineering services, will introduce the Andes Solbot II Multi-Point Selective Soldering System in Booth #2401 at the upcoming IPC APEX Expo, scheduled to take place February 28-March 1, 2012 at the San Diego Convention Center in California.

The Solbot Selective Soldering System uses customized and dedicated fixtures/nozzles. The lead-free compatible system is user-friendly and features a compact footprint of only 540x720x250 mm.

The Solbot can solder PCBs up to 260x340 mm. Additionally, the number of components on the PCB does not affect tact time.

For more information, meet company representatives in Booth #2401 at the show or visit www.seikausa.com.

Seika Machinery, Inc. (SMI) is a subsidiary of Seika Corporation, Japan and member of the Mitsubishi Global Group. SMI provides electronics manufacturers with advanced machinery, superior materials and engineering services.

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