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Nordson Showcases Its Market-Leading Test and Inspection Systems at SEMICON West

Jun 13, 2017

Quadra™ 7 X-ray Inspection system.

Quadra™ 7 X-ray Inspection system.

Nordson DAGE and Nordson YESTECH, divisions of Nordson Corporation (NASDAQ: NDSN), announce plans to exhibit in Booth #5644 at SEMICON West, scheduled to take place July 11-13, 2017 at the Moscone Center in San Francisco, CA. The Nordson Test & Inspection team will showcase a suite of award-winning systems targeted at both the Semiconductor and PCBA markets, including the Quadra™ 7 X-ray Inspection system, M1m AOI system and 4800 Advanced Wafer Testing Bondtester.

Nordson DAGE’s flagship system – the new Quadra™ 7 with 0.1μm sub-micron feature recognition – comes equipped with two 4K UHD displays and 8 million pixels to fully show the 50μm pixel pitch and 6.7MP image size of the Aspire FP™ detector. 4K UHD offers up to 4 times the detail compared to standard HD display screens and supports 68,000X total magnification.

The Nordson YESTECH M1m AOI system offers high-speed microelectronic device inspection with exceptional defect coverage. With resolutions down to submicron levels and telecentric optics, the M1m provides complete inspection, all within a footprint less than 1 m2.

The Nordson DAGE 4800 Advanced Automated Wafer Testing bondtester is at the forefront of wafer testing technology catering for the testing of wafers from 200mm up to 450mm.

Advanced technology guarantees unsurpassed accuracy and repeatability to provide total confidence in product quality. A range of powerful camera and optical systems optimize load tool alignment, auto programming and post test analysis make the 4800 system the pinnacle of automated wafer testing.

Representatives also will be available to discuss the XM8000 Wafer X-ray Metrology platform that takes the market-leading capabilities from Nordson DAGE’s existing X-ray systems to provide an automated, high-throughput X-ray metrology and defect review system for both optically hidden and visible features of TSVs, 2.5D and 3D IC packages, MEMS and wafer bumps. The XM8000 provides unprecedented, non-destructive, in-line wafer measurement of voiding and fill levels, overlay, critical dimensions and much more.


Headquartered in Aylesbury, UK, Nordson DAGE is a unit of the Nordson Corporation and manufactures and supports a complete range of award winning digital X-ray inspection systems and bond test equipment for the printed circuit board assembly and semiconductor industries. For more information, visit www.nordsondage.com.

Headquartered in Carlsbad, California, Nordson YESTECH is a leading provider of automated optical systems with integrated yield enhancement solutions for the printed circuit board assembly  and advanced semiconductor-packaging industries, Nordson YESTECH is operated and managed by a team of industry experts with a history of success, bringing powerful and cost-effective inspection to the electronics market. The company has sales offices and customer support centers in North America, Asia and Europe. For more information on Nordson YESTECH and its products, visit www.nordsonyestech.com.

Nordson Corporation engineers, manufactures and markets differentiated products and systems used for the precision dispensing and processing of adhesives, coatings, polymers and plastics, sealants, biomaterials and other materials and for fluid management, test and inspection, UV curing and plasma surface treatment, all supported by application expertise and direct global sales and service. Nordson serves a wide variety of consumer non-durable, durable and technology end markets including packaging, nonwovens, electronics, medical, appliances, energy, transportation, construction, and general product assembly and finishing. Founded in 1954 and headquartered in Westlake, Ohio, the company has operations and support offices in more than 30 countries. Visit Nordson on the web at www.nordson.com, www.twitter.com/Nordson_Corp or www.facebook.com/nordson.

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