SMT, PCB Electronics Industry News

BTU to Show PYRAMAX Vacuum Reflow Oven at NEPCON Asia

Jul 14, 2020

BTU International, Inc. will exhibit at NEPCON Asia, scheduled to take place Aug. 26-28, 2020 at the Shenzhen Convention & Exhibition Center. The company will showcase the PYRAMAX™ Vacuum reflow oven in Stand 1N35.

“We’re finding that there are many applications that just cannot tolerate yield loss due to voiding, including automotive, aerospace, military, medical and others,” said Bob Bouchard, corporate marketing manager for BTU. “Our PYRAMAX Vacuum reflow system has controlled heating in the vacuum chamber, giving the tightest control of liquidus time in the industry.”

The PYRAMAX Vacuum reflow oven has been designed around requirements of large EMS/high-volume automotive customers. The unit is configured with 10 zones of closed-loop convection heating and a maximum production width of 18″. Nitrogen atmosphere capable, the PYRAMAX Vacuum reflow oven offers a maximum process temperature of 350° C. In addition to full Industry 4.0 compliance, the vacuum reflow unit features automatic sequencing, programmable control of vacuum level and hold time and pass-through mode for non-vacuum operation.

For more information about BTU International, visit www.btu.com.


BTU International, a wholly-owned subsidiary of Amtech Group (NASDAQ: ASYS), is a global supplier and technology leader of advanced thermal processing equipment in the electronics manufacturing market. BTU’s high-performance reflow ovens are used in the production of SMT printed circuit board assemblies and in semiconductor packaging processes. BTU also specializes in precision controlled, high-temperature belt furnaces for a wide range of custom applications, such as brazing, direct bond copper (DBC), diffusion, sintering and advanced solar cell processing. BTU has operations in North Billerica, Massachusetts, and Shanghai, China, with direct sales and service in the U.S.A., Asia and Europe. Information about BTU International is available at www.btu.com.

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