SMT, PCB Electronics Industry News
  • SMTnet
  • »
  • Industry News
  • »
  • MacDermid Alpha to Present Power Package Attach by Silver Sinteringat PCIM Asia Conference in Shanghai

MacDermid Alpha to Present Power Package Attach by Silver Sinteringat PCIM Asia Conference in Shanghai

Nov 06, 2020

The Assembly Division of MacDermid Alpha Electronics Solutions will be presenting the paper, “Power Package Attach by Silver Sintering – Process, Performance & Reliability“ at the PCIM Asia Conference 2020 which will take place from November 16-18 in Shanghai, China.

As silver sintering replaces solder at the die level (both for die attach and for top side attach), the bottleneck for further power cycling and overall thermal improvement is shifting to base-plate and heat sink levels. Due to the large areas involved, the higher CTE mismatch and the module´s inherent temperature dependent warpage, silver sintering at these levels brings specific process and reliability challenges. These challenges will be addressed in MacDermid Alpha’s paper presentation. As an alternative to printing, MacDermid Alpha will introduce a novel large area dispense process for silver sintering paste application that is particularly well suited for larger transfer-molded power packages. The process windows for drying and sintering will be defined, as well as their effect on joint integrity through die shear, acoustic microscopy, and thermal shock reliability testing. As well as discussing sintering paste, the paper will also demonstrate the use of novel sintering preforms that eliminate the paste application and drying steps altogether.

Wilson Wu, Application Manager – Die Attach, will be presenting the paper at 15:30pm on Tuesday, November 17th at Room 1 “Advanced Packaging Technologies” at Shanghai World Expo Exhibition and Convention Center Shanghai.For more information on Alpha’s Power Electronics and Assembly solutions, visit MacDermidAlpha.com or contact Wilson.Wu@MacDermidAlpha.com

PCIM Asia Conference 2020
Date:November 17, 2020 (Tuesday)
Time: 15:30 – 15:50
Venue:Room 1, Shanghai World Expo Exhibition and Convention Center Shanghai, China
Topic:Power Package Attach by Silver Sintering – Process, Performance & Reliability
Speaker: Wilson Wu,Application Manager - Die Attach


Through the innovation of specialty chemicals and materials under our Alpha, Compugraphics, Kester and MacDermid Enthone brands, we provide solutions that power electronics interconnection.  We serve all global regions and every step of device manufacturing within each segment of the electronics supply chain.   The experts in our Semiconductor Solutions, Circuitry Solutions, and Assembly Solutions divisions collaborate in design, implementation, and technical service to ensure success for our partner clients.  Our solutions enable our customers’ manufacture of extraordinary electronic devices at high productivity and reduced cycle time. Find out more at MacDermidAlpha.com.

Nov 12, 2020 -

MacDermid Alpha to Promote Latest Technology Offerings at the International Electronics Circuit Exhibition

Nov 03, 2020 -

MacDermid Alpha Releases CircuEtch 200 Anisotropic Final Etch for SAP and mSAP

Oct 31, 2020 -

MacDermid Alpha to Introduce Sintering Products at the Step-by-Step Technical Conference in Hangzhou China

Oct 16, 2020 -

MacDermid Alpha to Present Power Electronics Solutionsat China Powertrain Electrification and Innovation Summit in Shanghai

Oct 04, 2020 -

MacDermid Alpha to Exhibitat TPCA and Present atIMPACT-EMAP 2020 Conference

Sep 10, 2020 -

MacDermid Alpha to Exhibit and Promote Recent Product Launches at Semicon Taiwan

Sep 06, 2020 -

MacDermid Alpha to Exhibit and Promote Recent Product Launches at Semicon Taiwan

Aug 22, 2020 -

MacDermid Alpha to Present Void Reduction and Silver Free Alloy Solutions at SMTA South China Technology Conference in Shenzhen

Jun 24, 2020 -

MacDermid Alpha Launches Ultra-Low Temperature Solder and 5G Solutions at Productronica China 2020

Nov 27, 2020 -

Aker Technology and New Yorker Electronics Team Up with New Franchise Distribution Agreement

Nov 27, 2020 -

N2Power Expands Range of Medical-Grade Power Supplies

Nov 27, 2020 -

Murray Percival Co. Offers 15% off Web Store

Nov 27, 2020 -

Ultrasonic Spray For Electrode Coating

Nov 27, 2020 -

Improving Fuel Cell Performance With AI

Nov 27, 2020 -

Does hydrogen energy really work?

Nov 27, 2020 -

Will hydrogen energy vehicles eventually replace lithium batteries?

Nov 26, 2020 -

Vanilla Electronics Works with Altus to Put Staff Safety First

Nov 26, 2020 -

New Yorker Electronics Releases Approved Medical Devices from Polytron

Nov 25, 2020 -

Temperature Cycling Test Chamber Testing and Debugging Methods

See electronics manufacturing industry news »

MacDermid Alpha to Present Power Package Attach by Silver Sinteringat PCIM Asia Conference in Shanghai news release has been viewed 32 times

  • SMTnet
  • »
  • Industry News
  • »
  • MacDermid Alpha to Present Power Package Attach by Silver Sinteringat PCIM Asia Conference in Shanghai
pcb components vacuum pick up

Rapid Turn-Around Time