Nov 09, 2020 
Indium Corporation’s Tim Jensen, Senior Product Manager for Engineered Solder Materials, will present during IMAPS-UK/IEEE-EPS’sonline thermal management conference from Nov. 25-26.
Thermal system design is a critical aspect in both high-performance and quantum computing applications. Part of that system is the thermal interface material (TIM). In Advanced Metal Thermal Interface Materials for High- Performance Computing Applications,Jensen will begin with an overview of the thermal demands in these applications. From there, the focus will be on unique TIM technologies that can help enable or enhance active and passive cooling designs to ensure maximum performance. Sincethe use of metal-based TIMs is proving to be increasingly critical for success, several attributes of various metal TIMs will be reviewed to show how they can ensure the best performance in these applications.
IMAPS-UK/IEEE-EPS’ conference will feature the latest developments in passive and active cooling, materials, measurement, and modelling to address the challenges of enhancing thermal dissipation from advanced electronics systems. The conference will cover all aspects of designing, manufacturing, and testing of high thermal performance electronics, where miniaturization, costs, and reliability are critical features that need to be optimized.
Jensen has more than 20 years of experience working with customers troubleshooting and optimizing SMT process lines and solving defects, such as head-in-pillow, graping, and QFN voiding. Jensen has worked directly on hundreds of surface mount lines and developed a number of different products. Using that direct knowledge and expertise, he works closely with Indium Corporation’s technical service, sales, and research and development teams to develop cutting-edge products that address the unique challenges faced by the electronics assembly industry. As a senior product manager, Jensen is responsible for Indium Corporation’s most diverse product group, which includes solder preforms, wire, ribbon and foil, as well as thermal interface materials. He has authored many process and technical guidelines and has presented at numerous industry forums and conferences. In addition to his responsibilities at Indium Corporation, Tim also serves on the SMTA’s Board of Directors. In this role, he is part of the Strategic Development Committee where he leads the effort on international expansion. He earned his bachelor’s degree in chemical engineering from Clarkson University and his master’s in business administration from Syracuse University.
For more technical information from Indium Corporation’s experts, check out the company’s InSIDER Series—a free program designed to deliver expert technical content, share industry knowledge, and promote professional growth using a virtual platform. Current and future webinars can be found at www.indium.com/webinar.
Indium Corporation is a premier materials refiner, smelter, manufacturer, and supplier to the global electronics, semiconductor, thin-film, and thermal management markets. Products include solders and fluxes; brazes; thermal interface materials; sputtering targets; indium, gallium, germanium, and tin metals and inorganic compounds; and NanoFoil®. Founded in 1934, the company has global technical support and factories located in China, India, Malaysia, Singapore, South Korea, the United Kingdom, and the USA.
For more information about Indium Corporation, visit www.indium.com or email jhuang@indium.com. You can also follow our experts, From One Engineer To Another® (#FOETA), at www.facebook.com/indium or @IndiumCorp.
