bare die tape and reel machine, wafer to tape and reel machine, wafer to waffle tray

Features:

1. Can be used with 6-inch to 12 inch Wafer disk;
2. Compatible with JEDEC standard, 350 × 200 × 20 (mm) and below;
3. The standard nozzle can be quickly replaced according to the size of the product;
4. For 1.0 × 1.0 (mm) to 12 × 12 (mm) size die;
5. Suitable for QFN, CSP, Flip chip/die.