May 12, 2003 Automotive, Lead-free, Process Control and more, SMTA International
(September 21-25, Donald Stephens Convention Center, Rosemont, IL) is
dedicated to surface mount, advanced packaging, and related
technologies. This year's program will feature many special events,
including free programs each day, such as the following.
A presentation on Six Sigma will explain why it is the right roadmap to
achieve breakthrough performance in these challenging times, and how
following Siz Sigma will help attendees become stronger, faster and more
profitable companies.
The NEMI Roadmap covers 18 Technical Working Groups chapters grouped into
five technology groups. NEMI also coordinates with numerous other
roadmapping organizations to coordinate schedules and industry
elements. This presentation will go into detail of what makes up the
individual chapters and how the process works to culminate in a complete
document.
Board Talk is an open, enjoyable forum intended to cut through the
marketing hype, platitudes, and incompetent, unscientific baloney regarding
electronic assembly problems and related matters. The instructors are
donating all proceeds from attendance to the SMTA Charles Hutchins
Scholarship Fund. Audience participation is essential to this lively forum
format.
Manufacturing Migrations to China is a half-day symposium on business and
technology issues surrounding electronics manufacturers moving operations
to China. Topics include Component Procurement and Distribution, Capital
Equipment Production, and Business and Regulatory Climate Preparedness.
A presentation on Reducing Your Line Set Up Time will start with a review
of basic setup and changeover concepts followed by real-life case studies
from RadiSys, where the average changeover time is around 20 minutes
(including first article inspection).
A panel discussion, Future SMT Practices, will feature short presentations
by industry experts discussing pick-and-place, solder, printing, reflow,
test/inspection and rework, all with respect to lead-free materials,
optoelectronics, MEMS, Bluetooth, integrated manufacturing, process control
software, and EMS activity in China. Audience participation is also
encouraged in this diverse panel format.
Returning from previous years will be the ever-popular symposiums on
Electronics Manufacturing Services (EMS) and Lead-free Soldering; as well
as the Emerging Technologies Summit, where attendees will get a glimpse of
what the future holds for SiP/3-D, MEMS, and Wireless. The Emerging
Technologies Summit will finish with a panel discussion providing
participants an excellent opportunity to interact with experts.
The Opening Session will feature Status of the Technology, an informative
overview of component, substrate and assembly issues, including Component
Trends - A Review of IPC 7095 BGA Implementation, Substrate Trends and
Issues-Surface Finish Comparison, Assembly Trends and Issues-Low Volume
Assembly, and Solder Trends and Issues-Lead Free Soldering.
Led by conference chair Rob Rowland, RadiSys Corporation, the highly
regarded SMTA International Technical Advisory Committee is comprised of
electronics manufacturing and packaging experts who represent all facets of
the industry. SMTA International is co-located with the Assembly Tech Expo
(ATExpo) at the Donald Stephens Convention Center in Rosemont, Illinois
(Conference: September 21-25 Exhibits: September 23-25).
For more information and developments regarding SMTA International visit
the on-line brochure at smta.org/smtai, or contact SMTA administrator JoAnn
Stromberg: joann@smta.org or 952-920-7682.
The SMTA membership is a network of professionals who build skills, share
practical experience and develop solutions in electronic assembly
technologies and related business operations.
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