Rogers� new R/flex 3000 family of materials now includes a single-clad lower melt point and a double-clad high melt temperature laminate. These materials offer a unique combination of mechanical, electrical, thermal, and environmental properties for tightly controlled impedance flex interconnections, next generation wireless handsets, high-density flip-chip chip packages and moisture resistant sensors.
Excellent electrical properties:
Dielectric Constant of 2.9, Dissipation Factor of 0.002 at 10GHz and low moisture absorption (0.04%) in applications where high frequency/high speed circuits are designed;
Dimensional stability where fine line features are defined and reliable performance is critical; and
Superior chemical resistance where exposure to corrosive chemicals is required. LCP is a halogen-free material.
The increased demand for high-speed microprocessors above 5GHz and ASICs for 10Gbps (and 40Gbps for high-end routers and servers) stimulates the need for Rogers R/flex 3000 LCP products. Based on a thermotropic LCP polymer, the family includes laminates with CTE�s matched to copper, dielectric variants with high or low nematic melt points creating a unique advanced circuit materials system suited for the fabrication of high speed, high density, environmentally friendly flex, multi-layer, rigid-flex, and mixed dielectric circuit designs.
Rogers Corporation, headquartered in Rogers, CT, U.S.A., develops and manufactures high-performance specialty materials, which serve a diverse range of markets including: wireless communications, computers and networking, imaging, transportation and consumer. Rogers operates manufacturing facilities in Connecticut, Arizona, Illinois in the U.S., in Gent, Belgium, and in Suzhou, China. Sales offices are located in Japan, Hong Kong, Taiwan, Korea, China, and Singapore.
Rogers Website: http://www.rogerscorporation.com
Cynthia N. Kiss
R/flex� is a licensed trademark of Rogers Corporation