Seika Machinery Announces More Green Benefits of Its Solder Paste Recycling Unit

TORRANCE, CA — Seika Machinery, Inc., a leading provider of advanced machinery, materials and engineering services, announces that with the implementation of its patent pending Solder Paste Recycling (SPR) unit, Seika is able to reduce the amount of waste material to less than 10 percent of current volumes by recycling solder paste.

Solder paste used with screen printers has a limited shelf life. When solder paste is exposed to the environment, solvents evaporate and cause it to dry. This leads to misprints, which requires disposal since it is no longer useable. However, instead of disposing of it, solder paste now can be recycled in-house.

“The Seika SPR allows for companies to move forward with green initiatives that may be designated in-house or through local government provisions as well as save significant costs by recycling leftover solder material for reuse in another process,” said Michelle Ogihara, Sales and Marketing Manager.

Seika’s new SPR Unit enables the separation of flux and solder, using a special solder pot mechanism that inverts during each cycle. In approximately 34-45 minutes, the unit turns wasted solder paste into solder bar. The maximum volume per cycle is approximately 5.5 lb (2.5 kg).

The easy-to-use system enables approximately 90 percent of waste solder paste to be recovered as solder bar. The system provides a major decrease in disposal costs for factory waste, a reduction in CO2 emissions, and reduced costs for solder bar as a result of recycling waste.

About Seika Machinery, Inc.

Seika Machinery, Inc. (SMI) is a subsidiary of Seika Corporation, Japan and member of the Mitsubishi Global Group. SMI provides electronics manufacturers with advanced machinery, superior materials and engineering services.