Profiling and Solder Reflow Course

Category:

PCB Assembly Courses

Where | When:

Pennsylvania, Philadelphia | Jun. 16 - Jun. 17, 2020

Pennsylvania, Philadelphia | Sep. 16 - Sep. 17, 2020

Pennsylvania, Philadelphia | Dec. 21 - Dec. 22, 2020

Description:

ACI Technologies offers multiple training courses about the business of electronics assembly; this course is intended to provide personnel with the knowledge and skills necessary to set up and operate a reflow process. Upon completion of this class, students will be able to apply their knowledge of reflow soldering techniques by successfully identifying the heat transfer modes and systems for each reflow method covered.

Content:

  • Heat Transfer
  • Current Reflow Methods
  • Processing Atmosphere (and how to use it to your advantage)
  • Profile Development (includes hands-on session)
  • Board Instrumentation and Profile Refinement (includes hands-on session)

Who Should Attend

Engineers, technicians, quality assurance personnel and managers can familiarize themselves with the various processes, equipment, analytical tools/materials used in establishing and refining an effective time-temperature profile. This course is ideal for senior technicians, engineers, and supervisors/group leaders desiring to increase their knowledge of electronics manufacturing through both classroom discussion and hands-on experience.

Url:

https://store.aciusa.org/Profiling-and-Solder-Reflow-P248.aspx

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