Virtual Course: PCB Design for Implementing 3D and High Density Semiconductor Package Technologies
Where | When:
SMTA International Professional Development Course
Wednesday, March 30, 2022 | 10:00am-1:30pm US Central
Instructor: Vern Solberg, Solberg Technical Consulting
Product developers looking for higher functionality and reach their performance and miniaturization goals are relying more on higher density semiconductor package innovations. Although integrating several semiconductor functions onto a single die element (System-on-Chip) appears to provide a viable solution for some, development cost and time has often proved to be excessive. For that reason, many manufacturers will rely heavily on more innovative IC package solutions, often integrating a number of already proven functional elements within a single-package outline.
This capability has been stimulated by the rapid deployment of new semiconductor packaging innovations from a broad number of domestic and offshore competing companies’ that understand that new product time-to-market can be the difference between leading and following.
This tutorial addresses the PCB design and assembly challenges for developing and implementing a broad range of high-density semiconductor package methodologies including flip-chip and array configured, multiple function 3D System-in-Package (SiP) technologies
When:Wednesday, March 30, 2022
Presenter:Vern Solberg, Solberg Technical Consulting
1. BGA/CSP Process Technologies and Standards
2. Innovative Solutions for 2D, 2.5D and 3D Packaging
3. Printed Circuit Board Design Guidelines for HDI
4. HDI Circuit and Micro PCB Design Implementation
5. Specifying PCB Base Material, Surface Finish and Coatings
6. Preparation for High Volume Assembly Processing
This coarse will benefit PCB Designers, Design Engineers and those responsible for semiconductor package and electronic product development, assembly processing and manufacturing efficiency as well as manufacturing and test engineering specialists for the OEM, ODM, EMS and OSATs (Outsourced Assembly and Test) providers.