Electronics Forum | Fri Jun 01 14:50:29 EDT 2001 | Matt Gormont
I am looking for outline tolerances of a flip chip with a pitch of .25mm. Bumps are made of 63/37 solder. Key tolerances are bump height and positional tolerance of the bumps. Can anyone HELP?
Electronics Forum | Wed Sep 23 20:38:30 EDT 1998 | parag
does anyone know what exactly the term "characterization of a machine" means?i need to characterize a flip chip bonder which has the capacity to mount the dies on substrates not more than 2" x 2" size.please respond asap.
Electronics Forum | Thu Sep 24 13:17:34 EDT 1998 | Dave F
| does anyone know what exactly the term "characterization of a machine" means?i need to characterize a flip chip bonder which has the capacity to mount the dies on substrates not more than 2" x 2" size.please respond asap. Parag: Check the link bel
Electronics Forum | Thu Sep 24 07:43:12 EDT 1998 | Earl Moon
| does anyone know what exactly the term "characterization of a machine" means?i need to characterize a flip chip bonder which has the capacity to mount the dies on substrates not more than 2" x 2" size.please respond asap. Characterization means det
Electronics Forum | Thu Feb 12 21:30:45 EST 2004 | davef
Comments are: * We're amazed that you can thermocompression bond to epoxy. * Silver may be oxidizing during expoxy cure. * Klein Wassink talks about aging in THE BOOK [Soldering in Electronics: A Comprehensive Treatise on Soldering Technology for Sur
Electronics Forum | Wed Feb 11 09:07:37 EST 2004 | Ashok Thiyagarajan
HI I am currently having a wafer which is stud bumped (Au), I am printing conductive adhesives (with silver fillers) on the pads , and by thermocompression bonding, I am establishing the connnection between. But right now the problem is the silver
Electronics Forum | Mon May 07 15:03:06 EDT 2007 | jmelson
Yes, I took the chuck off head 3, and made my own nozzle, which is working quite well. I can't set head 3 to vision, as this machine doesn't have the vision system. I set it to "IC" and that seems to work fine. I set mech alignment 1 and 2 to yes,
Electronics Forum | Thu May 03 22:51:14 EDT 2007 | jmelson
I am still learning the CSM84, but have gotten one board programmed and working. Now, I'm doing the next board, and need to use the mechanical alignment unit for a 22 x 22 mm TQFP. This chip is too large to clear the jaws on any head. Can the CSM h
Electronics Forum | Fri May 29 20:15:15 EDT 1998 | Steve Gregory
Whoo-doggies Jason, you said a mouthfull!! (GRIN) Anyways, 'member what I said about me being a pack-rat? Guess what? I found some documentation that I've had for a while that does document the self-alignment forces that goes on when reflowing. I ha
Electronics Forum | Fri May 04 02:32:10 EDT 2007 | jmelson
Thanks! Well, the procedure in the book says to first calibrate the mech aligner with the beam sensor, but that exceeds the X travel. I guess you can just eyeball it off the nozzles and then use trial and error. While poking around on the machine
