969 electrovert and reflow and oven, and omniflo and 7, and 7 and zones results

Virtual Access Technique Augments Test Coverage on Limited Access PCB Assemblies

A Novel Material for High Layer Count and High Reliability Printed Circuit Boards

Using Flexible Circuits as an Electronic Interconnection... Do's and Don'ts

Hermetically Sealed SMD Tantalum Capacitors

SMTnet Express May 16 - 2013, Subscribers: 26118

New Methods of Testing PCB Traces Capacity and Fusing

SMT Express, Volume 4, Issue No. 1 - from SMTnet.com

Near Term Solutions For 3D Packaging Of High Performance DRAM

SMT Express, Volume 5, Issue No. 7 - from SMTnet.com

SMT Express, Volume 5, Issue No. 7 - from SMTnet.com   Aligning the design and supply chains Component selection is often based on design and technology needs alone, with little thought given to downstream supply chain/manufacturing concerns

Process optimization -Lead free wave soldering of simple to highly complex boards