Electronics Forum | Fri Apr 14 13:30:20 EDT 2000 | Murad Kurwa
Hi All: Can you tell me specifically if you converted an exiting product made with Clean process using WS609 or compatible to 'No-Clean' process. We have to convert assemblies from current clean process at a CEM to No-Clean process in our own factor
Electronics Forum | Tue Apr 04 23:01:37 EDT 2000 | Dean
Does Fuji America have a trade in program? I know they used to on vision cards and such. It may be worth your while to get a trade in allowance rather than none at all. The alternative, as you mentioned, is to repair it yourself. This however, w
Electronics Forum | Fri Mar 10 08:42:40 EST 2000 | John
We're quoting out a new board design, and one of the prospective suppliers is pitching a silver coating process over hot air leveling. We haven't had experience with boards of this type, and I am concerned about any processing issues that may come u
Electronics Forum | Tue Feb 29 13:18:16 EST 2000 | Steve Schrader
We have what appears to be a recurring problem. On immersion gold boards only, we are having solderability problems. After reflow, selected parts can be popped right off the board. There is then a dark haze left on the pad. The paste on the compon
Electronics Forum | Mon Jan 29 11:11:29 EST 2001 | Casey Scheu
The solder ball collapse is associated with overheating. Of coarse there's no problem taking it off, your nuking it. The problem, as your aware, is in the replacement. The machine your using is overdriving the process. The key to this repair is in
Electronics Forum | Tue Jan 23 20:53:51 EST 2001 | davef
Sorry, not much help for me there. More information would be helpful. For instance: * Talk about the distribution of the problem, including a single lot or from various lots and over components and component types on the board * Tell us about the boa
Electronics Forum | Tue Jan 30 01:32:24 EST 2001 | PeteC
Bill, We do solderpaste reflow on through-hole here every day on plated-thru-holes. We do it on connectors only. It is a reliable process. We use no special profile. The stencil apertures must be modified for this process. Check out the IPC-7525 "St
Electronics Forum | Tue Feb 13 07:26:26 EST 2001 | doctord
Bill, I can give you suggestions. First and foremost. Print a board and look under a microscope. Are you printing exactly on the pads? If you print on the mask, no matter how good we got the profile, no matter what paste we would get solder balls. Mo
Electronics Forum | Wed Feb 21 20:40:44 EST 2001 | jagman
I appreciate both of your responses. I spoke with a tech rep at a distributor of the Loctite 3609 and asked him if this adhesive can be cured using a bake oven (Blue M, Despatch, etc.), rather than convection/IR. He stated that he's never heard of
Electronics Forum | Wed Feb 21 21:21:10 EST 2001 | davef
Gary: It doesn't matter what you use to cure your glue. SMA adhesives are thermosets. This means they become hard on cure and this is not reversible. A couple of things go on with SMA adhesives when you heat them. * Their rheology is temperature
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