Electronics Forum | Wed Jan 14 18:33:21 EST 2004 | ex maintain leader
qfp tray one corner on the holder is 45 degree cutted there is the pin 1 bga also one corner is different in the tray at tape packaging I'm not sure, I have seen diferent comissions belong supliers
Electronics Forum | Tue Nov 01 14:46:31 EDT 2011 | davef
Agilent TestJet Technology White Paper In the early 1990s, the testing of digital parts became problematical. Previous in-circuit test techniques sought to ensure a correct, functioning part by applying digital patterns, called vectors, to the input
Electronics Forum | Mon Oct 19 15:43:37 EDT 2009 | dilogic
We have a problem with QFN IC's with NiPdAu plated pads. Our ULC's don't see the pads due to the almost ideal reflection. Vision sees the pads almost black. As we don't have OAL-cameras (which can help in this case, I assume), I am thinking of back-l
Electronics Forum | Fri Jan 16 07:48:29 EST 2004 | Mika
We usually program the components in the component database with pin 1 in the lower left corner. Then in the feeder database we set the component orientaion to 270 deg for Tray feeders(turn the tray in the feeder 180 deg) and "tube" feeders. For tape
Electronics Forum | Mon Mar 13 06:11:08 EST 2006 | Rob
Surely this is a job for Wavemaster Larry? Have you tried flux buster pins in your ICT yet? They are quite good at cutting through the crap on a board.
Electronics Forum | Mon Dec 17 19:01:45 EST 2007 | bbarton
As someone with a LOT of experience with the "low cost" alternative alloys, primarily SACX, I have one simple question....Are these shorts a new phenomena? WAS your process in control, and all of a sudden it's not? If the answer is YES, take a look a
Electronics Forum | Fri Nov 18 12:35:15 EST 2011 | rway
As the article eludes to, you still need probe access to measure the pins with TestJet. One thing I wanted to add was the use of JTAG for use with Boundary Scan. Certain devices have JTAG capability, but not all JTAG devices are Boundary Scan compa
Electronics Forum | Tue Aug 10 06:58:48 EDT 2004 | dka123
dear all, kindly guide me for the use of space electronics hardware assembky of PQFPs and Cqfps, how to form the flat pack leads, bend for 240 pins of 20 mil pitch and what are the Mil standards for them.how to cut the lead guards.can we use FP5 elit
Electronics Forum | Fri Feb 06 03:56:47 EST 2004 | JaMi Smith
BGAs and QFPs packaged in Trays are oriented with Pin 1 or corner A1 oriented towards the Pin 1 identifier on one corner of the Tray, which is usually identified by a chamfered corner. The Trays themselves are usually governed by JEDEC Registered Ou
Electronics Forum | Tue Mar 07 21:35:16 EST 2006 | Cal Kolokoy
Samir, From experience, the only board test situation where tented via's have difficulty with contact is with a Flying Probe type tester. Otherwise, for traditional ICT, the force of the pogo pins, correct probe type, and fixture design should do th
