Influence of Nanoparticles, Low Melting Point (LMP) Fillers, and Conducting Polymers on Electrical, Mechanical, and Reliability Performance of Micro-Filled Conducting Adhesives for Z-Axis Interconnections.
Credit/Source: Rabindra N. Das, Konstantinos I. Papathomas, John M. Lauffer and Frank D. Egitto
This paper discusses micro-filled epoxy-based conducting adhesives modified with nanoparticles, conducting polymers, and low melting point (LMP) fillers for z-axis interconnections, especially as they relate to package level fabrication, integration, and reliability. A variety of conducting adhesives with particle sizes ranging from 80 nm to 15 μm were incorporated as interconnects in printed wiring board (PWB) or laminated chip carrier (LCC) substrates.
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